摘要
针对国内某复位监控电路在低温环境使用时出现的异常复位问题,开展了故障机理分析与防护设计研究。通过故障复现、波形监测及对比试验分析,定位失效原因为工艺升级导致铝线宽度和晶体管沟长缩减,造成与国外同类型器件相比电源寄生电容减小,从而导致抗电磁干扰能力下降。同时在电路设计中存在有源晶振与监控电路布局不合理,在低温时由于复位监控电路阈值电压的升高,晶振产生的电磁干扰效应更加明显,最终触发了误复位。为避免此类问题的发生,提出了多种防护措施,包括优化电路布局、滤波电容设计、加强电源稳定性设计以及完善环境与干扰测试流程。本研究揭示了工艺升级对复位监控电路低温可靠性的影响机制,为复位监控电路的设计与验证提供了参考。
For the abnormal reset problem that occurred in a certain domestic reset monitoring circuit when used in a low-temperature environment,research on fault mechanism analysis and protection design was carried out.Through fault reproduction,waveform monitoring and comparative test analysis,the cause of the failure was determined to be that the process upgrade led to a reduction in the width of the aluminum wire and the length of the transistor trench,resulting in a decrease in the parasitic capacitance of the power supply compared with similar devices abroad,thereby reducing the ability to resist electromagnetic interference.At the same time,in the circuit design,there is an unreasonable layout of the active crystal oscillator and the monitoring circuit.At low temperatures,due to the increase in the threshold voltage of the reset monitoring circuit,the electromagnetic interference effect generated by the crystal oscillator becomes more obvious,eventually triggering a false reset.To prevent such problems from occurring,a variety of protective measures have been proposed,including optimizing circuit layout,designing filter capacitors,strengthening power supply stability design,and improving the environmental and interference testing process.This study reveals the influence mechanism of process upgrading on the low-temperature reliability of reset monitoring circuits,providing a reference for the design and verification of reset monitoring circuits.
作者
杨洪泰
姚铁峰
戴思莹
沈留阳
周海洋
YANG Hongtai;YAO Tiefeng;DAI Siying;SHEN Liuyang;ZHOU Haiyang(Beijing Institute of Radio Metrology and Measurement,Beijing 100039,China)
出处
《宇航计测技术》
2026年第1期57-61,共5页
Journal of Astronautic Metrology and Measurement
关键词
复位电路
低温工作
电磁干扰
工艺改进
Reset circuit
Low-temperature operation
Electromagnetic interference
Process Improvement
