摘要
对陶封光控电子开关电路中陶瓷盖板的加固胶型与加固工艺开展了系统研究,重点考察了不同黏度绝缘胶体及多种涂覆方式对电路电连接稳定性的影响。实验结果表明,陶瓷盖板的组装加固方法与电信号传输稳定性密切相关:采用高黏度白胶进行划线加固,电路在500次温度循环后正向压降稳定在1.33~1.34 V,电信号无异常;而使用低黏度黑胶划线加固后,部分电路出现正向压降升高,存在连接失效风险。进一步研究表明,采用双侧对称点涂黑胶的方式可显著改善胶体分布均匀性,使电路在温循及机械实验后仍保持1.34 V左右的稳定正向压降。仿真分析揭示,低温(-65℃)下不对称胶体分布会在导电胶中引入高达25.07 MPa的应力,显著高于对称结构(13.54 MPa),是导致粘接界面失效的主要原因。综上,采用高黏度胶体划线加固或双侧对称点涂加固均可有效提升界面粘接的稳定性,保障电路在复杂环境下的长期可靠性。
A systematic study on the reinforcement adhesives and reinforcement techniques for ceramic cover plates in ceramic encapsulated optically controlled electronic switching circuits were conducted,and the influences of insulating adhesives of different viscosities and various coating methods on the stability of electrical connections in circuits were emphatically investigated.Experimental results indicate that the assembly and reinforcement methods of the ceramic cover plate are closely related to the stability of electrical signal transmission.Using high-viscosity white adhesive for line reinforcement,the forward voltage drop of the circuits remain stably at 1.33-1.34 V after 500 temperature cycles,and there are no abnormal electrical signals.After using low-viscosity black adhesive for line reinforcement,some circuits exhibited an increase in forward voltage drop,indicating a risk of connection failure.Further research demonstrates that coating the black adhesive at the bilateral symmetric dots can significantly improve the uniformity of adhesive distribution,ensuring the circuits to maintain a stable forward voltage drop of approximately 1.34 V even after temperature cycling and mechanical tests.Simulation analysis reveals that asymmetric adhesive distribution at low temperatures(-65℃)will introduce the stress of up to 25.07 MPa in the conductive adhesive,which is significantly higher than that of the symmetric structure(13.54 MPa),that is the main cause of bonding interface failure.In summary,using the high-viscosity adhesive line reinforcement method or the bilateral symmetric dot coating reinforcement method can effectively enhance the stability of the interface bonding,ensuring the long-term reliability of the circuits in complex environments.
作者
韩文静
冯春苗
李尧
肖泽平
袁海
Han Wenjing;Feng Chunmiao;Li Yao;Xiao Zeping;Yuan Hai(The No.771 Institute,The 9th Academy,China Aerospace Science and Technology Corporation,Xi'an 710065,China)
出处
《微纳电子技术》
2026年第2期140-146,共7页
Micronanoelectronic Technology
关键词
陶封光控电子开关
陶瓷盖板
电信号
加固工艺
可靠性
ceramic encapsulated optically controlled electronic switch
ceramic cover plate
electrical signal
reinforcement technique
reliability
