摘要
面对半导体产业从“代工制造”向“自主创新”转型的空间需求,传统产业园区“厂房+配套”模式已难以回应“高智人群”对研发、生活、品牌昭示的复合诉求。本文以江波龙中山存储产业园为实证样本,构建“场地诊断—需求量化—符号转译—空间验证”的四步研究框架,提出“芯片符号空间转译+功能弹性复合+气候适应性优化”的三维策略体系。研究证实:以Flash Die晶圆结构为母题的立面符号系统,可有效提升企业品牌识别度;“底层架空+独立核心筒+弹性单元”的空间骨架,使园区在三年内完成从研发→测试→生产的无痛迭代;通过“留景框、留风廊、留绿院”的被动式气候策略,夏季空调负荷降幅可达18.7%。
Confronted with the spatial demands of China’s semiconductor sector as it pivots from pure-play foundry work to proprietary R&D,the conventional“factory-plus-amenities”campus model no longer satisfies knowledge workers’combined expectations for research infrastructure,lifestyle quality and corporate branding.Taking the Longsys Zhongshan Memory Industrial Park as a full-scale test case,this paper establishes a four-step research protocol—site diagnosis→demand quantification→symbol translation→spatial validation—and proposes a three-dimensional strategy that integrates chip-symbol spatial translation,functional elastic hybridization and climate-adaptive optimization.The study demonstrates that:a faç=ade system derived from the Flash Die wafer pattern significantly raises corporate brand visibility;a spatial armature of raised podiums,independent cores and elastic modules enables the campus to evolve painlessly from R&D through testing to pilot production within three years;passive-climate tactics that preserve view corridors,wind paths and courtyard greenery cut peak-cooling loads by up to 18.7%.
作者
邓爱财
郭晓
Deng Aicai;Guo Xiao(The Chinese University of Hong Kong,Shenzhen 518127)
出处
《建设科技》
2025年第22期88-92,共5页
Construction Science and Technology
关键词
芯片特色
研发综合体
空间基因
弹性设计
气候适应性
Chip characteristics
R&D complex
Spatial gene
Elastic design
Climate adaptability
