摘要
针对高功率电子元器件热管理与可靠性需求,解决传统灌封材料难兼顾导热、力学与耐候性的问题,开发综合性能优异的高导热有机硅灌封材料。以不同黏度双端乙烯基聚硅氧烷为基础胶,通过硅氢加成反应制备有机硅灌封胶材料;调控SiH/SiVi摩尔比,结合傅里叶变换红外光谱(FT-IR)、差示扫描量热(DSC)、热失重(TGA)及电学测试表征材料性能。结果表明,当SiH/SiVi摩尔比为1.2时,材料性能最优:导热系数为3.212 W/(m·K),拉伸强度为2.8 MPa,断裂伸长率为61%,邵氏A硬度为63 HA;125℃固化60 min后SiH与SiVi反应完全;玻璃化转变温度(Tg)低至-122℃,5%失重温度(T5%)达435℃,800℃热失重保持率为90%;体积电阻率为1.3×10^(14)Ω·cm, 1 MHz介电常数为3,绝缘强度为30 kV·mm^(-1)。该灌封胶兼顾高导热、优异力学性能、宽温域耐候性与高绝缘性,为高功率电子元器件灌封保护提供关键材料,具有工程应用价值。
This study aimed to develop high thermal conductive silicone encapsulant materials with excellent comprehensive performances,and to overcome the limitation that traditional potting materials struggle to balance thermal conductivity,mechanical properties,and weather resistance—thereby meeting the thermal management and reliability requirements of highpower electronic components.Silicone encapsulant materials were fabricated via hydrosilylation reaction,with vinyl-terminated polysiloxanes of varying viscosities used as the base polymer.The molar ratio of SiH/SiVi was tailored,and the resultant material properties were systematically characterized using Fourier Transform Infrared Spectroscopy(FT-IR),Differential Scanning Calorimetry(DSC),Thermogravimetry(TGA),and electrical performance tests.The results demonstrate that the material exhibits optimal performance when the SiH/SiVi molar ratio is 1.2:Its thermal conductivity reaches 3.212 W/(m·K),tensile strength is 2.8 MPa,elongation at break is 61%,and Shore A hardness is 63 HA.After curing at 125℃for 60 minutes,the SiH and SiVi groups react completely.The material has a glass transition temperature(Tg)as low as-122℃,a 5%weight loss temperature(T5%)of 435℃,and a weight retention rate of 90%at 800℃.Additionally,its volume resistivity is 1.3×10^(14)Ω·cm,dielectric constant at 1 MHz is 3,and dielectric strength is 30 kV·mm^(-1).This encapsulant integrates high thermal conductivity,excellent mechanical properties,wide-temperature-range weather resistance,and high insulation performance.It provides a critical material for the potting protection of high-power electronic components and holds significant engineering application potential.
作者
陈丽敏
朱舒燕
赵丁伟
张政军
王炜鹏
CHEN Limin;ZHU Shuyan;ZHAO Dingwei;ZHANG Zhengjun;WANG Weipeng(Beijing Santel Technology&Trading Co.,Ltd.,Beijing 100854,China;School of Materials Science and Engineering,Tsinghua University,Beijing 100084,China)
出处
《电子元件与材料》
北大核心
2025年第12期1489-1495,共7页
Electronic Components And Materials
基金
清华大学先进材料教育部重点实验室开放课题(Advmat-2404)。
关键词
高导热
加成型
有机硅灌封胶
制备
力学性能
highly thermal conductive
addition-cure
silicone encapsulant
preparation
mechanical properties
