摘要
随着5G通讯技术的飞速发展,电子设备需要更高的信号传输速率以及更低的信号延迟,具有低介电常数与低介电损耗特征的介质材料在高频通讯组件中具有广阔的应用前景。综述了近年来国内外低介电有机硅材料的研究进展,总结了降低有机硅材料介电常数的主要方法:降低分子极化率和减少单位体积内极化分子的数量,并展望了未来低介电有机硅材料的发展方向。
With the rapid development of 5G communication technology,electronic devices need higher signal transmission rate and lower signal delay.Dielectric materials,with low dielectric constant and low dielectric loss characteristics,have broad application prospects in high-frequency communication components.The research progress of low dielectric silicone materials at home and abroad in recent years was reviewed,and the main methods to reduce the dielectric constant of silicone materials were summarized:lowering the molecular polarizability and reducing the number of polarized molecules per unit volume.The development directions of low dielectric silicone materials in future were also prospected.
作者
向略
李霞
杨佳祺
张叶琴
Xiang Lue;Li Xia;Yang Jiaqi;Zhang Yeqin(China Bluestar Chengrand Chemical Co.,Ltd.,Chengdu 610041;Research Center of National Silicone Engineering Technology,Chengdu 610041)
出处
《化工新型材料》
北大核心
2025年第11期19-27,共9页
New Chemical Materials
关键词
有机硅材料
低介电常数
低介电损耗
偶极子
聚合物
silicone materials
low dielectric constant
low dielectric loss
dipole
polymer
