摘要
针对当前热板合金设备良品率低,运行效率低,自动化程度低等缺点,研究了热板合金设备的各部分结构,提出了一种适应于合金设备的热板温度控制方案,使得热板的温度稳定性及温度均匀性都有了很大提高,提出了一种节拍协同优化技术,提高了设备的运行效率。在用户现场工艺验证过程中,降低了晶圆方阻不均匀性增加值,能够很好地保证晶圆形成欧姆接触的工艺效果,提高了设备良品率以及设备运行效率。
Aiming at the shortcomings of the current hot plate alloy equipment such as low yield,low operating efficiency and low automation,this paper introduces the structure of each part of the hot plate alloying equipment,proposes a hot plate temperature control scheme suitable for alloying equipment,which greatly improves the temperature stability and temperature uniformity of the hot plate,and puts forward a beat coordination optimization technology to improve the operating efficiency of the equipment.In the process of on-site process verification by users,the increase in the non-uniformity of wafer sheet resistance has been reduced,which can well ensure the process effect of forming ohmic contacts on wafers,and improve the equipment yield and operating efficiency.
作者
暴翔
刘畅
冯凯
BAO Xiang;LIU Chang;FENG Kai(The 2^(nd) Research Institute of CETC,Taiyuan 030024,China)
出处
《电子工业专用设备》
2025年第5期18-23,共6页
Equipment for Electronic Products Manufacturing
关键词
热板合金
温度控制技术
欧姆接触
Hot plate alloying
Temperature control technology
Ohmic contact
