摘要
为突破传统四官能团环氧树脂四缩水甘油基二氨基二苯甲烷(TGDDM)黏度高、韧性差的技术瓶颈,本文以间氨基苯酚环氧树脂(mAP-E)为基体,通过调控其与TGDDM的共混比例,构建了JmAP系列环氧胶粘剂体系。系统研究了该胶粘剂体系的工艺性能、耐热特性和力学性能等关键指标。研究结果表明:(1)mAP-E体系能够显著降低TGDDM的黏度,所制备的JmAP胶粘剂具有较低的黏度,从而表现出良好的工艺性能。(2)通过分析胶粘剂的玻璃化转变温度(T_(g)),在JmAP系列胶粘剂中,TGDDM含量增加使T_(g)值向高温区移动,JmAP-5的玻璃化转变温度(T_(g)=164.7℃)较JmAP-0提高了16.3%,证明TGDDM的引入显著改善了环氧胶粘剂体系的耐热性能。(3)通过分析力学性能,JmAP系列胶粘剂随着TGDDM比例的增加,在不同温度下的各项力学性能都有不同程度的提升。其中,JmAP-5在高温下的综合力学性能相对较为突出,各温度下的拉伸剪切性能优良。在宽温域拉伸剪切性能测试中,JmAP-5也表现出最佳综合性能。(4)吸水性能分析表明,在JmAP系列胶粘剂体系中,各配方胶粘剂的吸水率均未超过0.5%,展现出优异的耐久性和使用寿命。(5)电学性能分析表明,JmAP系列胶粘剂的电容稳定性良好,波动范围在0.15 pF以内,相对介电常数相差不超过0.15,介电损耗在2%以下。其中JmAP-5的电学性能最好,1000 Hz下的电容为5.37~5.53 pF,介电损耗低于1.72%,相对介电常数在4.14~4.22之间。这说明JmAP-5配方有着优异的电学性能,可以适用于电子绝缘领域。
To overcome the technical bottleneck of high viscosity and poor toughness of traditional tetra functional group epoxy resin of tetraglycidyl diaminodiphenylmethane(TGDDM),a series of JmAP epoxy adhesive systems were established in this article by using m-aminophenol epoxy resin(mAP-E)as the matrix and adjusting its blending ratio with TGDDM.The key performance indicators such as the processability,thermal resistance,and mechanical properties of adhesive systems were investigated systematically.The research results showed that,(1)The mAP-E system could significantly reduce the viscosity of TGDDM,and the prepared JmAP adhesive had a lower viscosity,thus exhibiting good processability(.2)By analyzing the glass transition temperature(T_(g))of the adhesive,it was found that in the JmAP series adhesive,the increase in TGDDM content caused the T_(g) value to shift towards higher temperatures.The glass transition temperature(T_(g)=164.7℃)of JmAP−5 increased by 16.3%compared to JmAP-0,demonstrating that the introduction of TGDDM significantly improved the heat resistance of the epoxy adhesive system.(3)By analyzing the mechanical properties,the JmAP series adhesive showed varying degrees of improvement in various mechanical properties at different temperatures with the increase of TGDDM ratio.Among them,JmAP-5 had relatively outstanding comprehensive mechanical properties at high temperature and excellent tensile shear properties at various temperatures.In the wide temperature range tensile shear performance test,JmAP-5 also showed the best comprehensive performance.(4)The analysis of water absorption performance showed that in the JmAP series adhesive system,the water absorption rate of each formula adhesive did not exceed 0.5%,demonstrating excellent durability and service life(.5)Electrical performance analysis showed that the JmAP series adhesive had good capacitance stability,with the fluctuation range within 0.15 pF,the relative dielectric constant difference of no more than 0.15,and the dielectric loss of less than 2%.Among them,JmAP-5 had the best electrical performance,with the capacitance of 5.37−5.53 pF at 1000 Hz,the dielectric loss of less than 1.72%,and the relative dielectric constant between 4.14-4.22.This indicated that the JmAP-5 formulation had excellent electrical properties and could be applied in the field of electronic insulation.
作者
张翼
虞鑫海
Zhang Yi;Yu Xinhai(College of Chemistry and Chemical Engineering,Donghua University,Shanghai 201620,China)
出处
《中国胶粘剂》
2025年第9期27-34,40,共9页
China Adhesives
