摘要
为提升高端服务器系统板的布线密度和信号完整性,传统的深孔背钻改为深微盲孔设计,其盲孔纵横比超过1.5∶1。研究离子注入和化学沉铜2种金属化工艺的深镀能力及其电镀组合方案,验证满足印制电路板(PCB)可靠性测试要求的直通型设计深微盲孔,电镀纵横比可达1.7∶1;阶梯型设计深微盲孔的电镀纵横比可达到2.2∶1。综合可靠性测试和切片数据,进而推断出满足可靠性要求的深微孔最小深镀能力和最低镀铜厚度。
In order to improve the wiring density and signal integrity of the high-end server system board,the traditional deep hole back drilling has been changed to a deep micro-blind hole design,with a blind hole aspect ratio of more than 1.5∶1.The throwing power of two types of metallization technologies with ion implantation and chemical copper deposition and different plating combination schemes were studied.It was verified that the plating aspect ratio of the deep micro blind hole with the straight design could reach 1.7∶1,and the plating aspect ratio of the deep micro blind hole with the step design could reach 2.2∶1.Based on the reliability test and micro section data,the minimum throwing power and minimum copper plating thickness of deep micro-holes can be deduced to meet the reliability requirements.
作者
付艺
王锋
FU Yi;WANG Feng(Zhuhai Fangzheng Circuit Board Development Co.,Ltd.,Zhuhai 519175,Guangdong,China;Zhuhai Huanxin Fangzheng Technology Co.,Ltd.,Zhuhai 519020,Guangdong,China)
出处
《印制电路信息》
2025年第9期23-28,共6页
Printed Circuit Information
关键词
印制电路板
深微盲孔
电镀铜
可靠性
printed circuit board(PCB)
deep micro blind hole
copper plating
reliability
