摘要
金刚石/Cu复合材料兼具金刚石和Cu的优异性能,具有高硬度、高热导率、低热膨胀系数、耐磨损等特点,是金属基复合材料领域研究重点之一。最早的金刚石/Cu复合材料制备工艺为高温高压烧结,该工艺可有效避免金刚石颗粒石墨化带来的负面影响。随着工业及科技的不断发展,业界出现了多种制备工艺。在复合材料内添加金属钛,可改善金刚石/Cu复合材料内部的主要相含量、微观组织结构、界面结构等结构特征(影响其整体性能的关键因素)。系统综述国内外金刚石/Cu复合材料制备技术,阐述金属钛对金刚石/Cu复合材料导热性能、热膨胀性能、力学性能、微观组织及界面反应机制等方面的影响,分析当前金刚石/Cu复合材料研究存在的问题,并对复合材料未来发展方向进行展望。
Diamond/Cu composite materials combine the advantages of diamond and Cu,and have excellent properties such as high hardness,high thermal conductivity,low coefficient of thermal expansion,and good wear resistance.They are one of the research focuses in the field of metal-based composite materials.The preparation of diamond/Cu composite materials was first carried out using high-temperature and high-pressure sintering processes,which can effectively avoid the negative effects of graphitization of diamond particles.With the continuous development of industry and technology,various preparation processes have emerged in the industry.Adding titanium metal to composite materials can improve the main phase content,microstructure,interface structure and other structural characteristics inside diamond/Cu composite materials,the key factors affecting their overall performance.A systematic review is conducted on the domestic and international technologies for the preparation of diamond/Cu composite materials.The influence of titanium metal on the thermal conductivity,thermal expansion properties,mechanical properties,microstructure,and interface reaction mechanism of diamond/Cu composite materials is elucidated.The current research problems in diamond/Cu composite materials are analyzed,and the future development direction of composite materials is discussed.
作者
代晓南
王晓燕
周雪
白玲
栗正新
DAI Xiaonan;WANG Xiaoyan;ZHOU Xue;BAI Ling;LI Zhengxin(College of Advanced Materials Engineering,Zhengzhou Technical College,Zhengzhou 450100,China;School of Materials Science and Engineering,Henan University of Technolog,Zhengzhou 450001,China;Henan Diamond Material Intelligent Manufacturing Engineering Research Center,Zhengzhou 450100,China)
出处
《电子与封装》
2025年第8期92-99,共8页
Electronics & Packaging
基金
河南省科技攻关项目(242102220083)。
关键词
金刚石/Cu复合材料
金属钛
界面结构
热导率
diamond/Cu composite material
titanium metal
interface structure
thermal conductivity
