摘要
为了解决环氧类导热涂层导热系数低的问题,采用改性氮化硼、改性碳化硅作为复合填料优化热传导通道以增强水性环氧树脂涂层的导热性,并研究了改性填料的结构特征及其用量对涂层导热性能、耐腐蚀性能的影响。结果表明:复合填料的最佳添加质量分数为55%,此时氮化硼/碳化硅/水性环氧树脂复合涂层的热导率高达2.39 W/(m·K),是纯环氧树脂导热率的824%,涂层的自腐蚀电位比纯环氧树脂涂层提升了约40%,腐蚀电流密度从纯EP涂层的1.58μA/cm^(2)降到了0.17μA/cm^(2),有效提升了涂层的耐腐蚀性能。该研究为导热涂层材料在电子设备散热、防护等领域的应用提供了有力支持。
In order to solve the problem of low thermal conductivity of epoxy thermal conductivity coating,using modified boron nitride and modified silicon carbide as composite fillers,the heat conduction channel was optimized to enhance the thermal conductivity of waterborne epoxy resin coating,and the structural characteristics of modified fillers and the effect of filler content on the thermal conductivity and corrosion resistance of the coatings were investigated.The results showed that the optimal addition amount of composite filler was 55%.In this case,the thermal conductivity of boron nitride/silicon carbide/water-based epoxy resin composite coating was as high as 2.39 W/(m·K),which was 824% of the thermal conductivity of pure epoxy resin.The self-corrosion potential of the coating was about 40%higher than that of pure epoxy resin coating.The corrosion current density of was decreased from 1.58μA/cm^(2)of pure EP coating to 0.17μA/cm^(2),which effectively improved the corrosion resistance of the coating.This study provides strong support for the application of thermal conductive coating materials in the field of heat dissipation and protection of electronic equipment.
作者
孙嘉庚
伍林
刘盈
阮世诚
汪予安
胡雅
SUN Jiageng;WU Lin;LIU Ying;RUAN Shicheng;WANG Yu'an;HU Ya(School of Chemistry and Chemical Engineering,Wuhan University of Science and Technology,Wuhan 430081,China;Institute of Applied Chemistry,Wuhan University of Science and Technology,Wuhan 430081,China;School of Resources and Environmental Engineering,Wuhan University of Science and Technology,Wuhan 430081,China)
出处
《热固性树脂》
2025年第4期23-27,共5页
Thermosetting Resin
关键词
导热涂层
氮化硼
碳化硅
水性环氧树脂
防腐
thermal conductivity coating
boron nitride
silicon carbide
waterborne epoxy resin
corrosion resistance
