摘要
为探究铣磨工艺对红外硅镜片表面损伤层的影响,提升硅镜片表面加工质量,通过构建磨具磨粒空间运动轨迹模型,系统分析了镜片铣磨过程中表面损伤层的去除机制,确定砂轮转速、工件转速、砂轮轴向进给速度和铣磨深度为影响表面加工质量的关键因素。通过设计水平工艺实验,运用正交实验方法对理论分析进行验证。结果表明,工件表面损伤程度与加工半径、砂轮轴向进给速度,以及铣磨深度呈正相关,与工件转速和砂轮转速呈负相关。通过优化工艺参数,可有效降低镜片表面粗糙度,减小面形误差,提升红外硅镜片的表面加工质量。
To explore the influence of milling-grinding processes on the surface damage layer of infrared silicon lenses and enhance the surface machining quality,a spatial motion trajectory model of abrasive grains in grinding tools is constructed.The removal mechanism of the surface damage layer during lens milling-grinding is systematically analyzed,and the key factors such as grinding wheel speed,workpiece rotation speed,axial feed rate of the grinding wheel and milling depth affecting surface machining quality are identified.Horizontal process experiments are designed,and orthogonal experimental methods are employed to validate the theoretical analysis.Results show that the degree of workpiece surface damage is positively correlated with machining radius,axial feed rate of the grinding wheel,and milling depth,while negatively correlated with workpiece rotation speed and grinding wheel speed.Optimizing process parameters can effectively reduce surface roughness,minimize surface shape errors,and improve the surface machining quality of infrared silicon lenses.
作者
李明智
刘庆
冯硕春
刘燕
LI Mingzhi;LIU Qing;FENG Shuochun;LIU Yan(The 46^(th)Research Institute,CETC,Tianjin,China)
出处
《光电技术应用》
2025年第3期69-75,共7页
Electro-Optic Technology Application
关键词
表面粗糙度
砂轮转速
工件转速
铣磨深度
砂轮进给
surface roughness
grinding wheel rotation speed
workpiece rotation speed
milling-grinding depth
grinding wheel feed
