摘要
外设组件互联快速总线(Peripheral Component Interconnect Express,PCIe)与串行快速IO(Serial Rapid IO,SRIO)是主流的高速通信接口协议。在以人工智能为代表的大数据量应用场景中,实现上述协议兼容是构建大算力系统、突破存储与算力瓶颈的关键。针对上述需求,芯粒间互联通信协议(Chiplets Interconnect Protocol,CIP)以统一的路由网络实现了PCIe、SRIO、DDR与NAND FLASH等多协议转换交互。其中,PCIe作为主要的人机交互接口,构建PCIe RP(Root Port,根节点)系统是实现PCIe通信的基础。现有的基于操作系统的PCIe读/写设备存在延迟高、可操作性差等问题。为解决上述问题,基于Cortex-M3处理器搭建了一套PCIe RP系统,并进行了相应的驱动与软件开发,实现了PCIe与各类设备之间高效而精确的数据传输。在实现基本功能的基础上,分别完成了5万次、10万次、15万次的大规模数据交互的稳定性测试。结果表明,该系统在大规模数据交互事件中有较好的稳定性,为处理器与PCIe间的数据交互提供了解决方案。
PCIe and SRIO are the mainstream high-speed communication interface protocols.In the large data application scenario represented by artificial intelligence,achieving the compatibility of the above protocols is the key to build a large computing power system to break through the bottleneck of storage and computing power.In view of the above requirements,CIP interconnection core realizes multi-protocol conversion interaction such as PCIe,SRIO,DDR and NAND FLASH with a unified routing network.Among them,PCIe is the main human-computer interaction interface,and the construction of PCIe RP system is the basis of PCIe communication.The existing PCIe reading and writing devices based on operating system have some problems,such as high delay and poor operability.In order to solve the above problems,a PCIe RP system is built based on Cortex-M3 processor,and the corresponding drivers and software are developed,which realizes efficient and accurate data transmission between PCIe and various devices.On the basis of realizing the basic functions,the stability tests of 50000 times,100000 times and 150000 times of large-scale data interaction were completed respectively.The results show that the system has good stability in large-scale data interaction events.It provides a solution for data interaction between processor and PCIe.
作者
徐俊杰
魏敬和
刘国柱
何健
张正
XU Junjie;WEI Jinghe;LIU Guozhu;HE Jian;ZHANG Zheng(State Key Laboratory of Integrated Circuits and Microsystems,Wuxi 214063,China)
出处
《集成电路与嵌入式系统》
2025年第8期74-80,共7页
Integrated Circuits and Embedded Systems
基金
江苏省自然科学基金(BK20232029)
江苏省揭榜挂帅项目(BE2023005)。
