摘要
伴随着全球供应链的本土化和区域化转型,世界各主要经济体已将供应链的安全性和自主性视为首要战略考量,以应对全球供应链因高度相互依赖而引发的“断链”风险。由于芯片产业处于技术竞争的核心地带,美国于2022年颁布了《创造有利半导体生产的激励措施与科学法案》,其目的是通过政府补贴美国本土芯片制造业重塑全球芯片产业链布局。然而,该法案关于芯片产业激励措施构成的《补贴与反补贴措施协议》下的补贴定义,虽然难以构成禁止性补贴,但符合可诉补贴的构成要件,违反了《补贴与反补贴措施协议》义务。我国等受该法案影响的WTO成员应积极利用WTO争端解决机制,完善贸易救济法律体系,依法维护芯片产业的正当合法利益。
With the localization and regionalization transformation of global supply chains,major economies worldwide have prioritized the security and autonomy of supply chains to address the risk of disruptions arising from the high interdependence of global supply chains.As the chip industry is at the core of technological competition,the U.S.enacted the Creating Helpful Incentives to Produce Semiconductors and Science Act to reshape the global chip supply chain through government subsidies for domestic chip manufacturing.The incentive measures for the chip industry under this Act fall within the definition of subsidies under the Agreement on Subsidies and Countervailing Measures.While these measures are difficult to constitute prohibited subsidies,they meet the constituent elements for actionable subsidies and thus violate the obligations under the Agreement on Subsidies and Countervailing Measures.China and other WTO members affected by the Act should actively utilize the WTO dispute settlement mechanisms,improve the trade remedy legal systems,and safeguard the legitimate interests of the chip industries in accordance with law.
作者
杨梦莎
刘星月
YANG Meng-sha;LIU Xing-yue(Law School,Tianjin University,Tianjin 300072,China)
出处
《青岛科技大学学报(社会科学版)》
2025年第2期67-75,共9页
Journal of Qingdao University of Science and Technology(Social Sciences)
基金
国家社科基金青年项目“供应链贸易安全规则研究”(22CFX045)。
关键词
《补贴与反补贴措施协议》
《芯片与科学法案》
产业补贴
国际合规性
Agreement on Subsidies and Countervailing Measures
CHIPS and Science Act
industrial subsidies
international compliance
