摘要
采用金相显微镜、扫描电子显微镜、能谱仪观察均匀化退火后5005铝合金铸锭的微观组织,分别用电导率仪和硬度计测量合金电导率和硬度,研究均匀化退火温度对5005铝合金组织性能的影响。结果表明,5005铝合金中的第二相主要由Al 3 Fe和Mg_(2) Si组成。随着均匀化退火温度的升高,合金的电导率呈下降趋势,但整体变化较小;在520~540℃,电导率轻微上升,这主要与Mg_(2) Si相的析出有关。随着均匀化退火温度的升高,Al 3 Fe相逐渐回溶。
The microstructure of 5005 aluminum alloy ingot after homogenization annealing was observed using a metallographic microscope,scanning electron microscope,and energy dispersive spectrometer.The alloy′s electrical conductivity and hardness were measured with the conductivity meter and hardness tester,respectively,to investigate the effect of homogenization temperature on the microstructure and properties of the 5005 aluminum alloy.The results show that the second phases in the 5005 aluminum alloy mainly consist of Al 3Fe and Mg_(2)Si.As the homogenization temperature increases,the electrical conductivity of the alloy tends to decrease,though the overall change is minor.Between 520℃and 540℃,the electrical conductivity slightly increases,primarily due to the precipitation of the Mg_(2)Si phase.With the rise in homogenization annealing temperature,the Al 3Fe phase gradually dissolves.
作者
曹晔
高崇
吴建新
贵星卉
阙石生
邓桢桢
刘贞山
黄瑞银
CAO Ye;GAO Chong;WU Jianxin;GUI Xinghui;QUE Shisheng;DENG Zhenzhen;LIU Zhenshan;HUANG Ruiyin(Chinalco Ruimin Co.,Ltd.,Fuzhou 350015,China;Chinalco Materials Application Research Institute Co.,Ltd.,Beijing 102209,China)
出处
《轻合金加工技术》
2025年第4期21-25,44,共6页
Light Alloy Fabrication Technology
基金
福建省技术创新重点攻关及产业化项目(2024G012)。
关键词
5005铝合金
均匀化退火
微观组织
晶粒组织
5005 aluminum alloy
homogenization annealing
microstructure
grain structure
