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住宅外墙外保温材料性能研究 被引量:2

Performance Study of Residential External Wall Insulation Materials
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摘要 外墙保温材料选取的合理性直接影响建筑结构保温性能和建筑能耗,开展外墙保温材料的性能研究对建筑绿色减碳具有重要意义,基于此,对比分析了常见外墙保温材料的构成、热力学性能和优缺点,并对6种常见外墙保温材料的热传导性能进行数值模拟。分析可知:保温材料厚度相同时,保温材料的保温性能由好至差依次为聚氨酯硬质泡沫板、发泡聚苯乙烯泡沫板、玻璃棉、岩棉板、泡沫玻璃板和玻化微珠保温砂浆;保温层外表面温度与保温层厚度呈线性相反关系,保温层厚度会增加结构的保温效果;随着保温层热传导系数的增加,保温层外表面温度增大,在进行保温层选择时,应尽量选取导热系数小的保温材料。 The rationality of the selection of external wall thermal insulation materials directly affects the thermal insulation performance of building structures and building energy consumption.It is of great significance to study the performance of external wall thermal insulation materials for building green carbon reduction.Based on this,the composition,thermodynamic performance,advantages and disadvantages of common external wall thermal insulation materials are compared and analyzed,and the heat conduction performance of six common external wall thermal insulation materials is numerically simulated.The analysis shows that when the thickness of thermal insulation materials is the same,the thermal insulation performance of thermal insulation materials from good to poor is polyurethane rigid foam board,foamed polystyrene foam board,glass wool,rock wool board,foam glass board and vitrified microsphere thermal insulation mortar.The outer surface temperature of the insulation layer is linearly inversely related to the thickness of the insulation layer,and the thickness of the insulation layer will increase the insulation effect of the structure.With the increase of the thermal conductivity of the insulation layer,the temperature of the outer surface of the insulation layer increases.When selecting the insulation layer,the insulation material with small thermal conductivity should be selected as far as possible.
作者 陈峰 CHEN Feng(China Railway 18th Bureau Group Beijing Engineering Co.,Ltd.,Beijing 100076,China)
出处 《施工技术(中英文)》 2025年第10期33-38,共6页 Construction Technology
基金 中铁十八局集团北京工程有限公司科研课题(BJGS-YF-2023-DKH-01)。
关键词 外墙 保温材料 热传导 数值模拟 exterior wall insulation materials heat conduction simulation
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