摘要
综述了聚酰亚胺(PI)薄膜自1965年于世界上首次实现商业化以来60年的发展历程。从商业化PI薄膜的诞生历史、相关基础研究领域进展以及在高技术领域中的应用发展等角度进行了阐述。重点综述了PI薄膜在结构设计与制造技术等方面的发展以及在航天、电工、微电子、光电等领域中的应用进展,并对PI薄膜的未来发展趋势进行了展望。
The commercial developments of polyimide(PI)films in the past 60 years from 1965 have been reviewed.The birth history,basic research conditions and the applications of PI films in high-tech fields etc were mainly introduced.Emphatically,the structural design,manufacturing procedures and the typical application progress in aerospace,electrical engineering,microelectronics,optoelectronics and other fields were presented.The future developing trends of the PI films were prospected.
作者
刘金刚
任茜
LIU Jin-gang;REN Xi(Engineering Research Center of Ministry of Education for Geological Carbon Storage and Low Carbon Utilization of Resources,School of Materials Science and Technology,China University of Geosciences(Beijing),Beijing 100083,China;Disan New Materials Science&Technology(Sanhe)Co.,Ltd.,Langfang 065200,China)
出处
《精细与专用化学品》
2025年第5期1-9,共9页
Fine and Specialty Chemicals
基金
深圳市科技计划项目(技术攻关重点项目)(JSGG20210629144539012)。
关键词
聚酰亚胺薄膜
缩合聚合
电工绝缘
航天应用
柔性覆铜板
polyimide films
polycondensation
electrical insulating
aerospace applications
flexible copper clad laminates
