摘要
随着电子元器件的高密度集成化、轻量化,聚酰亚胺基石墨膜凭借其优异的导热性能得到广泛的关注。研究使用4,4,-二氨基二苯醚和均苯四甲酸二酐作为单体进行共聚,磷酸钙为化学亚胺化试剂,研究了化学亚胺化试剂添加量对聚酰亚胺(PI)薄膜性能的影响,再进一步炭化、石墨化处理得到高导热PI基石墨膜,通过对石墨膜的微观形貌、晶型以及性能进行分析。结果显示,采用化学亚胺化法制备的PI薄膜经过石墨化处理后,所得石墨膜的微观形貌更加平整且致密有序、石墨化程度更高以及具有较大的晶粒尺寸和较小的晶格缺陷。当磷酸钙添加量为0.1%时,PI薄膜的拉伸强度达98.42 MPa,石墨膜的热导率达1623.9 W·m^(-1)·K^(-1)。在模拟散热测试过程中,仅需60 s即可将石墨膜表面温度从60℃快速降温24℃,在现代集成化先进电子元器件和高端电子产品等热管理领域都具有很好的应用潜力。
With the high-density integration and lightweight of electronic components,polyimide-based graphite film has attracted extensive attention due to its excellent thermal conductivity.In this study,4,4,-diaminodiphenyl ether and trimthalic acid dianhydride were used as monomers for copolymerization,and calcium phosphate was used as a chemical imidification reagent.The effect of chemical imitization reagent addition on the properties of polyimide(PI)film was studied.The results show that the microscopic morphology of the PI film prepared by chemical imidization method is smoother,denser and orderly,with higher graphitization degree,larger grain size and smaller lattice defects.When the calcium phosphate addition is 0.1%,the tensile strength of PI film reaches 98.42 MPa and the thermal conductivity of graphite film can reach 1623.9 W·m^(-1)·K^(-1).In the process of simulating heat dissipation testing,the surface temperature of graphite film can be rapidly cooled from 60℃to 24℃in just 60 seconds,which has great potential for application in modern integrated advanced electronic components and high-end electronic products and other thermal management fields.
作者
刘琪瑞
但沁松
王坤峰
崔若伟
李静
杨光智
LIU Qirui;DAN Qinsong;WANG Kunfeng;CUI Ruowei;LI Jing;YANG Guangzhi(School of Materials and Chemistry,University of Shanghai for Science and Technology,Shanghai 200093,China)
出处
《功能材料》
北大核心
2025年第5期5001-5007,共7页
Journal of Functional Materials
基金
国家自然科学基金(U1760119,51102169)。
关键词
聚酰亚胺
化学亚胺化
石墨膜
热导率
polyimide
chemical imidization
graphite film
thermal conductivity
