摘要
某产品接口板的多批次调试通过率仅在30%左右,设计师采用多投备板的形式来保障生产交付,成本和损耗非常大。为了提高该接口板组件(PCBA)的焊接质量,应用SIPOC方法,分析了生产阶段的薄弱环节和存在的技术短板,针对性地开展全流程制造过程质量管控,包括供应商来料管控、物料储存管控、关键过程控制管理、质量排故管理,多措并举,经过3个批次的生产验证,最终实现该接口板的一次调试通过率和返修合格率大幅提升,保证了该PCBA的焊接质量。
The interface board of a key aerospace product in our unit has a final pass rate of only around 30%,as the designer uses multiple backup boards to guarantee production and delivery which incurs significant costs and technical losses.To improve the soldering quality of the printed circuit board assembly(PCBA),we apply the SIPOC method to identify the weak links and analyze technical shortcomings in the production stage.As a result,quality control is conducted strategically throughout the entire manufacturing process,including supplier incoming material control,material storage control,process control quality management,and quality troubleshooting management.Having taken these measures and three batches of product verification,the one-time pass rate and repair qualification rate of the interface board have been significantly improved,enhancing the soldering quality of the PCB assembly.
作者
谭小鹏
张根
蔡萍
Tan Xiaopeng;Zhang Gen;Cai Ping(Xi′an Institute of navigation technology,Xi'an 710068,China)
出处
《质量与可靠性》
2025年第1期12-18,共7页
Quality and Reliability
