摘要
随着晶体管微缩逐渐放缓,先进封装和三维集成技术成为集成电路系统性能持续提升的重要路径。混合键合是一种具有高密度三维集成能力的键合工艺,在人工智能芯片制造等应用中扮演日益重要的角色。铜焊盘是混合键合负责信号传输与供电的接口,其物理化学特性决定了工艺的良率和可靠性。目前,国际领先半导体企业在混合键合铜焊盘工艺领域已取得显著进展,不仅建立了高密度金属化-等离子体活化-低温键合的系统化工艺流程,且通过技术迭代将铜焊盘的关键尺寸(直径与节距)微缩至亚微米级。相比之下,我国高校及科研机构在混合键合铜焊盘的研究中尚处于初期探索阶段,与国际先进水平相比,在实现超高密度混合键合的工艺能力与技术积累上仍存在显著差距。系统探讨了铜焊盘的几何形状、表面化学特性及晶粒组织对键合性能的影响,总结了该领域的优化策略及技术调整,为提高混合键合工艺能力的相关研究提供了参考。
As the scaling of transistors gradually decelerates,advanced packaging and three-dimensional integration technologies have emerged as crucial pathways for the continuous enhancement of integrated circuit system performance.Hybrid bonding,a bonding process with high-density three-dimensional integration capabilities,is playing an increasingly important role in applications such as artificial intelligence chip manufacturing.The copper pad serves as the interface for signal transmission and power supply in hybrid bonding,and its physicochemical properties determine the yield and reliability of the process.At present,leading international semiconductor companies have made remarkable progress in the field of hybrid bonding copper pad technology,not only establishing a systematic process of high-density metallization-plasma activation-low temperature bonding,but also reducing the key dimensions(diameter and pitch)of the copper pad to the sub-micron level through technical iterations.In contrast,China's universities and scientific research institutions are still in the early stage of exploration in the research of hybrid bonding copper pad,and compared with the international advanced level,there is still a significant gap in the process capability and technology accumulation to achieve ultra-high density hybrid bonding.The effects of the geometric morphology,surface chemical characteristics,and grain structure of copper pads on bonding performance are systematically discussed.The optimization strategies and technical adjustments in this field are summarized,which provide references for the related research on improving the capability of hybrid bonding processes.
作者
杨刚力
常柳
于道江
李亚男
朱宏佳
丁子扬
李力一
YANG Gangli;CHANG Liu;YU Daojiang;LI Ya’nan;ZHU Hongjia;DING Ziyang;LI Liyi(School of Integrated Circuits,Southeast University,Wuxi 214026,China)
出处
《电子与封装》
2025年第5期87-109,共23页
Electronics & Packaging
基金
国家自然科学基金(92373204)
江苏省自然科学基金(BK20230830)
东南大学青年跨学科研究计划(2024FGC1005)。
关键词
混合键合
先进封装
铜焊盘
表面改性
晶粒控制
hybrid bonding
advanced packaging
copper pad
surface modification
grain control
