摘要
目前PCB设计呈现高速、高密度、低电压发展趋势,同时复杂电子设备的电源完整性问题日益突出,不合理的PCB设计将导致去耦电容数量增多且达不到理想效果。为获得稳定、可靠的供电电源,文章在对发生电源完整性问题原因分析的基础上,提出了目标阻抗设计、电源平面走线设计、叠层设计等高速PCB电源完整性设计方法,并应用于设计实例中。针对PCB电源直流压降、电流密度两个方面,明确了仿真目标,并进行了仿真分析,从而验证了所应用电源完整性设计方法的有效性。
Currently,PCB design is showing a trend of high-speed,high-density,and low-voltage development.The power integrity issue of complex electronic devices is becoming increasingly prominent.unreasonable PCB design will lead to an increase in the number of decoupling capacitors and fail to achieve ideal results.To obtain a stable and reliable power supply,based on the analysis of the causes of power integrity issues,high-speed PCB power integrity design methods such as target impedance design,power plane routing design,and stack design are proposed and applied to design examples.The simulation objectives were clarified for three aspects of PCB power supply,including DC voltage drop,current density,and planar impedance,and simulation analysis was conducted to verify the effectiveness of the applied power integrity design method.
作者
赵娜
徐航
白艳放
ZHNO Na;XU Hang;BAI Yanfang
出处
《电力系统装备》
2025年第3期73-75,共3页
Electric Power System Equipment
关键词
PCB
电源完整性
去耦电容
目标阻抗
PCB
power integrity
decoupling capacitor
target impedance
