摘要
应用石墨烯孔金属化工艺替代传统化学沉铜工艺,对高厚径比印制电路板(PCB)进行石墨烯孔金属化,并对标GJB362C—2021《刚性印制板通用规范》中与孔金属化质量可靠性直接强相关的条款,进行质量可靠性验证;通过提升石墨烯孔化末端烘干效果,解决金相样件上疑似内层互联缺陷(ICD)的黑缝问题;通过极限热应力测试,确认样件耐受的极限热应力次数;设计厚径比为25∶1,最小孔径为0.2 mm的印制板,对石墨烯水平生产线的未来工艺空间进行验证,以期为石墨烯孔金属化水平线投建奠定基础。
In this paper,the graphene pore metallization process is used to replace the traditional electroless copper immersion process,and the graphene pore metallization is carried out on the high thickness ratio printed circuit board(PCB),and then the quality and reliability verification is carried out on the terms directly related to the quality and reliability of the hole metallization in the standard GJB362C―2021 General Specification for Rigid Printed Boards.In this paper,the black seam problem of suspected inner layer interconnection defect(ICD)on metallographic samples is solved by optimizing the drying effect of graphene porous ends.Through the ultimate thermal stress test,the number of ultimate thermal stresses that the sample withstands was confirmed.At the same time,a printed board with a thickness-diameter ratio of 25∶1 and a minimum aperture of 0.2 mm was designed to verify the future process space of the graphene horizontal production line and make preliminary preparations for the construction of the graphene pore metallization horizontal line.
作者
陈金文
何燕春
苟辉
李冬
陈伟元
CHEN Jinwen;HE Yanchun;GOU Hui;LI Dong;CHEN Weiyuan(Xi'an Institute of Aeronautical Computing Technology,Aviation Industry Corporation of China,Xi'an 710068,Shaanxi,China;Thumb Graphene Metallization S&T,Shenzhen 518000,China)
出处
《印制电路信息》
2025年第3期42-46,共5页
Printed Circuit Information
关键词
印制电路板
石墨烯
孔金属化
水平线
printed circuit board(PCB)
graphene
metallization of holes
horizontal line
