摘要
针对射频SiP模组设计周期长、成本高、兼容性差等问题,提出了一种射频SiP模组链路快速验证方法。该方法将射频SiP模组内的射频器件分装于不同积木块中,再将积木块拼接形成有目标电路功能的验证链路。通过对该链路进行测试,可快速验证射频SiP模组设计是否达标。为实现积木块间良好互连,设计了高频连接桥压接结构。测试结果经去嵌计算,得到18 GHz内插入损耗最大值为1.34 dB。通过搭建与测试二次变频射频SiP模组链路,表明该方法具备低损耗、可重构、可复用等特性,对射频SiP模组快速设计具有重要的工程意义。
To tackle the issues of long design cycles,high costs,and poor compatibility in radiofrequency(RF)system-in-package(SiP)modules,this paper presents a fast verification method for RF SiP module links.RF devices in the module are separately packed into different building blocks.These blocks are then assembled to form a verification link with the desired circuit functions.By testing this link,we can quickly check if the RF SiP module design meets the requirements.A high-frequency connection bridge crimping structure is designed for good inter-block connection.Test results,after de-embedding calculation,showed that within 18 GHz,the maximum insertion loss value was 1.34 dB.Building and testing the verification link of a dual-conversion RF SiP module demonstrated that the proposed method had low loss along with reconfigurable and reusable features.The rapid design of RF SiP modules is of great engineering importance.
作者
崔梦琦
余怀强
张磊
王玺
代春玥
CUI Mengqi;YU Huaiqiang;ZHANG Lei;WANG Xi;DAI Chunyue(CETC Academy of Chips Technology,Chongqing 401332,China;The 26th Research Institute of China Electronics Technology Group Corporation,Chongqing 400060,China)
出处
《压电与声光》
北大核心
2025年第1期108-112,共5页
Piezoelectrics & Acoustooptics
关键词
射频SiP
快速验证
高频连接桥
可重构
可复用
RF SiP
rapid verification
high-frequency connection bridge
reconfigurable
reusable
