摘要
C7025铜合金具有较高的强度和优良的导电率,被广泛应用于制备高端电子材料。近年来,电子产品逐渐向超薄化方向发展,不仅对合金强度的要求越来越高,而且要求其具有优良的折弯性能。本研究在传统工艺的基础上,通过增加拉弯矫工艺,借助金相显微镜、扫描电子显微镜和电子背散射衍射成像技术研究了织构微调对C7025铜合金板带折弯性能的影响。结果表明,拉弯矫处理前后试样的晶粒尺寸、强度、延伸率、显微硬度及电导率基本相同,但在轧制方向和宽度方向上的折弯性能存在差异。拉弯矫后,铜合金板带在宽度方向上的折弯性能更优,而在轧制方向的折弯性能变差,表现出较强的各向异性。这是因为拉弯矫工艺使铜合金板带发生了少量的塑性变形,改变了部分晶粒取向。铜合金板带中{123}<634>(S)形变织构增强,原{112}<111>(铜型)晶粒取向发生偏转,形成了较强的{112}<132>织构组分,导致宽度方向上的折弯性能优于轧制方向。本研究结果为实际生产工艺调整提供了理论依据。
C7025 copper alloy is widely used in high-end electronic materials due to its high strength,excellent electrical conductivity.In recent years,with the demand for ultra-thin electronic products,the strength requirement has become higher and higher,and the bending property must also be guaranteed,therefore,the process optimization is particularly important.The influence of fine-tuning texture on the bending property of C7025 copper alloy strip was studied by adding a tension leveling in the traditional process,using optical microscopy,scanning electron microscopy,and electron back scatter diffraction technology.The research results show that the grain size,strength,elongation,microhardness,and electrical conductivity of the samples before and after the tension leveling process were basically the same,but there were differences in bending property in the rolling direction and width direction.After the tension leveling process,the copper alloy strip had a better bending property in the width direction and a worse bendability in the rolling direction,showing a strong anisotropy.This is because the tension leveling process caused a small amount of plastic deformation,changing the orientation of some grains.The{123}<634>(S)deformation texture in the copper alloy strip was enhanced,the original{112}<111>(Copper)grain orientation shifted,and a stronger{112}<132>texture component formed,resulting in a better bending property in the width direction than in the rolling direction.The research findings provided theoretical basis for adjusting actual production processes.
作者
周晨
秦镜
胡铜生
ZHOU Chen;QIN Jing;HU Tongsheng(Jinvi Copper Branch of Tongling Nonferrous Metals Group Co.,Ltd.,Tongling 244000,China;Anhui Joint Key Laboratory of Critical Technologies for High-End Copper-Based New Materials,Tongling 244000,China;School of Mechanical Engineering,Tongling University,Tongling 244000,China)
出处
《江西冶金》
2024年第6期456-464,共9页
Jiangxi Metallurgy
基金
安徽省高校协同创新项目(GXXT-2022-090)
安徽省高等学校科学研究重点项目(2022AH051756)
铜陵学院人才科研启动基金项目(2022tlxyrc16)。
