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Cu-3.2Ni-0.75Si合金的时效析出强化效应分析 被引量:11

Analysis of intensified effect by aging of Cu-3.2Ni-0.75Si alloy
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摘要 研究Cu-3.2Ni-0.75Si合金在不同温度时效时的组织转变规律,测量在300-650℃时效不同时间后合金的强度和导电性能;采用透射电镜观察时效合金的显微组织,分析合金时效组织的强化机制。研究结果表明:随着时效时间的延长,合金的导电性能下降,其屈服强度和抗拉强度均快速增加至峰值后缓慢下降;合金在450℃时效处理时,时效2h以前的组织以调幅分解和有序化强化为主,时效4h以后的组织以Ni2Si相强化为主,在2~4h内时效组织强度由调幅分解、有序化和Ni2Si相的复合强化效应决定,合金具有明显的时效析出强化效应。 The effect on aging transformation of Cu-3. 2Ni-0.75Si alloy at different temperatures was studied. The strength and conductivity of alloy aged at 300-650℃ for different time were measured. The microstructures of aging alloy were observed by transmission electron microscopy. The intensify mechanism of aging structure was analyzed. The results show that with the prolong of aging time, the conductivity of alloy decreases, while the yield strength and tensile strength both increase to the maximal values quickly and then decrease slowly. When aging at 450℃, the alloy microcosmic structure is priority intensified by spinodal mechanism and ordering before 2 h, by Ni2 Si phases after 4 h, and the complex strengthened effect is determined by spinodal mechanism, ordering and Ni2Si phases during 2 - 4 h. Aging has strong intensified effect on the alloy.
作者 李宏磊
出处 《中南大学学报(自然科学版)》 EI CAS CSCD 北大核心 2006年第3期467-471,共5页 Journal of Central South University:Science and Technology
基金 国家2003年度火炬计划项目(0332030100)
关键词 CU-NI-SI合金 时效 强化 导电性能 Cu-Ni-Si alloy aging intensify conductivity
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参考文献10

  • 1曹育文,马莒生,唐祥云,王碧文,王世民,李红.Cu-Ni-Si系引线框架用铜合金成分设计[J].中国有色金属学报,1999,9(4):723-727. 被引量:60
  • 2Lockyer S A,Noble F W.Fatigue of precipitate strengthened Cu-Ni-Si alloy[J].Materials Science and Technology,1999,15(10):1147-1153.
  • 3柳瑞清,蔡薇,王晓娟,干学义,郝钢.铜合金引线框架材料的研究现状与发展[J].江西冶金,2003,23(6):80-83. 被引量:19
  • 4Rensei F.Development of copper alloy for lead frame[J].Journal of the Japan Copper and Brass Research Association,1997,36:25-32.
  • 5Lockyer S A,Noble F W.Precipitate structure in a Cu-Ni-Si alloy[J].Journal of Materials Science,1994,29:218-226.
  • 6赵冬梅,董企铭,刘平,康布熙,金志浩.超高强度Cu-Ni-Si合金时效过程研究[J].材料热处理学报,2002,23(2):20-23. 被引量:45
  • 7黄福祥,马莒生,朱继满,宁洪龙,铃木洋夫,耿志挺,陈国海.引线框架材料对铜合金与锡铅焊料界面组织的影响[J].电子元件与材料,2003,22(4):33-35. 被引量:8
  • 8娄花芬 赵冬梅 刘平 等.Cu—3.5Ni—0.75Si合金时效组织加工硬化效应分析[J].材料开发与研究,2003,18(1):1-3.
  • 9Zhao D M,Dong Q M,Liu P,et al.Structure and strength of the age hardened Cu-Ni-Si alloy[J].Materials Chemistry and Physics,2003,79(2):81 -86.
  • 10Zhao D M,Dong Q M,Liu P,et al.Aging behavior of Cu-Ni-Si alloy[J].Materials Science and Engineering A,2003,A361:94-100.

二级参考文献15

  • 1二冢练成.Development of copper alloy for leadframe[J].伸铜技术研究会志,1997,36(1):25-32.
  • 2曹育文.引线框架用高强高导铜合金研究[M].北京:清华大学,1999.57-66.
  • 3铃木竹四.The characteristics and processes in Cu-Ni-Si alloy heat treatment[J].伸铜技术研究会志,1994,33(1):152-160.
  • 4[1]Tomioka Y, Miyake. A copper alloy development for leadframe [A]. J Electronic Manufacturing Technology Symposium [C]. 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International, 1996, 433-436.
  • 5[2]Howard H M. Solders and soldering: Materials, Design, Production, and Analysis for Reliable Bonding [M]. New York: McGraw-Hill, 1992.
  • 6[3]Dirnfeld S F, Ramon J J. Microstructure investigation of copper-tin intermetallics and the influence of layer thickness on shear strength [J]. Supplement to Welding J, 1990, 373-377.
  • 7[4]Frear D R, Hosking F M, Vianco P T. Mechanical behavior of solder joint interfacial intermetallics [A]. In Proc Mater Develop Microelectron Packag Conf [C]. 1991. 229-240.
  • 8[5]Frear D R. The Mechanics of solder alloy interconnects [M]. New York: Van Nostrand Reinhold, 1994.
  • 9[6]Tu K N,Zeng K. Tin-lead (SnPb) solder reaction in flip chip technology [J]. Mater Sci Eng, 2001, (34): 1-56.
  • 10[7]Wassink R J K. Soldering in Electronics [M]. London: U K Electrochemical Publ, 1989. 149-159.

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