摘要
针对晶圆翘曲检测中晶圆受外力引入附加形变难以消除及量化的问题,面向快速高精度晶圆翘曲工业检测提出一种改进的竖直自动装夹方案,具有精确约束、装夹流程简单等优势。借助理论分析和有限元仿真结合晶圆翘曲表征方法,提出了一种晶圆装夹设计的分析方法,得到了不同关键设计参数与晶圆附加翘曲的关系,实现了竖直装夹机构关键参数的正向设计,并基于设计结果进行了重复装夹验证实验。分析及实验结果表明,竖直装夹在保证晶圆姿态倾角小于0.02°、底部固定约束位置斜面角度35°±1°、夹持力不大于2 N且与竖直方向夹角不超过2°时,可以保证300 mm单晶硅晶圆的附加翘曲弯曲度不超过70 nm,翘曲度不超过1000 nm。该装夹方案拥有精确约束和简洁装夹流程等优势,对研制300 mm晶圆高精度几何形貌测量仪及大尺寸光学元件装夹具有一定的指导意义。
To address the challenges of detecting additional deformation errors caused by external forces during wafer warpage detection-errors that are difficult to eliminate and quantify-this paper proposes an improved vertical automatic clamping solution for rapid and high-precision industrial wafer warpage detection.By leveraging theoretical analysis,finite element simulations,and wafer warpage characterization methods,the paper introduces an analytical approach to wafer clamping design,elucidating the relationship between key design parameters and additional wafer warpage.The study achieves forward design of critical parameters for the vertical clamping mechanism,with validation experiments for production and repeated clamping based on the design results.Analysis and experimental outcomes demonstrate that vertical clamping can ensure the additional bow of a 300 mm single-crystal silicon wafer does not exceed 70 nm,and the warp remains under 1000 nm,provided that the wafer attitude tilt angle is less than 0.02°,the bottom fixed constraint position slope angle is 35°±1°,and the clamping force is not more than 2 N with an angle not exceeding 2°from the vertical direction.This research offers practical guidance for developing a highprecision geometric profiling instrument for 300 mm wafers and large-size optical component clamping.
作者
张逸博
孔新新
赵思泽鹏
贾金刚
蒋德怀
宋佳慧
伍洲
ZHANG Yibo;KONG Xinxin;ZHAO Sizepeng;JIA Jingang;JIANG Dehuai;SONG Jiahui;WU Zhou(Aerospace Information Research Institute,Chinese Academy of Sciences,Beijing 100094,China;School of Optoelectronics,University of Chinese Academy of Sciences,Beijing 100094,China)
出处
《光学精密工程》
EI
CAS
CSCD
北大核心
2024年第15期2418-2428,共11页
Optics and Precision Engineering
基金
中国科学院青年创新促进会(No.2020131)。
关键词
晶圆翘曲测量
竖直装夹
附加形变
有限元分析
wafer warpage measurement
vertical clamping
additional deformation
finite element analysis
