摘要
电子器件芯片功率的不断提高对散热材料的热物理性能提出了更高的要求。将导热性能、力学性能优异的铜作为基体,加入高导热、低膨胀的增强体得到的铜基复合材料,能够兼顾热膨胀系数可调和高热导等特点,是理想的散热材料。重点对近年来以金刚石、石墨烯、石墨、碳纳米管、SiC为增强体的铜基复合材料的研究进展进行综述,并就高导热铜基复合材料目前存在的问题及未来的研究方向进行了展望。
With the rapid development of network communication,the increase of the unit heat production power of electronic chips puts forward higher requirements on the heat dissipation capacity of thermally conductive materials.Traditional metal thermally conductive materials can no longer meet the requirements for use,and it is imminent to develop new thermally conductive materials.The copper matrix composite material with excellent thermal conductivity and mechanical properties is used as the matrix,and the copper matrix composite material obtained by adding the reinforcement with high thermal conductivity and low expansion can take into account the characteristics of adjustable thermal expansion coefficient and high thermal conductivity.Based on the common characteristics of high thermal conductivity and low expansion,copper-based composite materials such as carbon material/copper,silicon carbide/copper,diamond/copper,etc.are widely used as ideal heat dissipation materials in the fields of semiconductor preparation,aerospace,and military defense.The types of reinforcements are classified,focusing on the research progress of copper matrix composites with diamond,graphene,graphite,carbon nanotubes and SiC as reinforcements in recent years,and the current problems and problems of high thermal conductivity copper matrix composites.Future research directions are prospected.
作者
鲍瑞
李兆杰
易健宏
陶静梅
郭圣达
BAO Rui;LIZhaojie;YI Jianhong;TAO Jingmei;GUO Shengda(School of Materials Science and Engineering,Kunming University of Science and Technology,Kunming 650093,China;Engineering Research Center of Tungsten Resources High-efficiency Development and Application Technology of the Ministry of Education,Jiangxi University of Science and Technology,Ganzhou 341000,China;Key Laboratory of Advanced Materials of Yunnan Province,Kunming University of Science and Technology,Kunming 650093,China)
出处
《粉末冶金工业》
CAS
北大核心
2022年第5期1-11,共11页
Powder Metallurgy Industry
基金
国家自然科学基金资助项目(52064032,52174345)
云南省重大科技专项计划项目(202202AG050004)
云南省科技厅重大科技专项云南省稀贵金属材料基因工程(202002AB080001)
钨资源高效开发及应用教育部工程研究中心开放课题(W-2021ZD001)
云南省新材料制备与加工重点实验室创新课题(2020KF004)
江西先进铜产业研究院开放课题(ZL-202006)。
关键词
铜基复合材料
高导热
制备工艺
粉末冶金
研究进展
copper matrix composite
high thermal conductivity
preparation process
powder metallurgy
research progress
