摘要
针对传统粘接工艺制作微带天线阵面存在的粘接强度差、环境适应性差、质量不稳定等问题,创新性地采用微笔直写3D打印技术打印微带天线阵面,开展了样件设计、打印参数及打印工艺对成型效果的研究。经测试,打印成型的天线阵面在孔精度、孔对位精度及驻波等关键性能指标方面均满足设计要求。论证了微笔直写技术可有效应用于微带天线阵面的快速制造和快速验证,为微笔直写打印微带天线阵面并实现工程化应用打下了良好的基础。
In view of the bad bonding strength,poor environmental adaptability and unsteady quality of microstrip antennas array made in traditional bonding process,3D printing with micropen direct writing is innovatively used to print microstrip antennas array.Using the samples,the effects of printing parameters and printing process on forming are studied.After testing,the printed samples meet the design requirements in key performance indicators such as precision,drilling deflection,and standing wave.It is demonstrated that the 3D printing with micropen direct writing technology can be effectively used for the rapid manufacturing and verification of microstrip antennas array,which provides a good foundation for the manufacturing of microstrip antennas array by 3D printing.
作者
张颖
ZHANG Ying(The 30th Research Institute of CETC,Chengdu 610041,China)
出处
《电子工艺技术》
2022年第6期357-360,共4页
Electronics Process Technology
关键词
微带天线阵面
微笔直写
3D打印
microstrip antennas array
micropen direct writing
3D printing
