摘要
以五水合硫酸铜为主盐,甲醛为还原剂,2,6−二氨基吡啶和2,2′−联吡啶为添加剂,在丙烯腈−丁二烯−苯乙烯(ABS)塑料树脂板上进行化学镀铜。研究了2,6−二氨基吡啶和2,2′−联吡啶用量对化学镀铜沉积速率和镀层表面形貌的影响,并通过阴、阳极极化曲线测试,分析了镀液中同时加入这两种添加剂对化学镀铜过程中甲醛氧化和铜离子还原的影响。结果表明,镀液中同时添加0.5 mg/L的2,6−二氨基吡啶和0.5 mg/L的2,2′−联吡啶时,沉积速率高达12.87μm/h,所得Cu镀层光亮、粉红,表面平整致密。
Electroless copper plating was carried out on the surface of acrylonitrile-butadiene-styrene(ABS)plastic resin in a bath based on copper sulfate pentahydrate with formaldehyde as reducing agent as well as 2,6-diaminopyridine and 2,2′-bipyridine as additives.The effects of the dosages of 2,6-diaminopyridine and 2,2′-bipyridine on the deposition rate during electroless copper plating and the surface morphology of the copper coating were studied.The effects of the addition of both additives on the oxidation of formaldehyde and the reduction of copper ions during electroless copper plating were analyzed by measuring the cathodic and anodic polarization curves.The results showed that the deposition rate was up to 12.87μm/h when electroless plating in a bath containing 2,6-diaminopyridine 0.5 mg/L and 2,2′-bipyridine 0.5 mg/L.The copper coating obtained was bright,pink,smooth,and compact.
作者
程熠
宋晅
朱皓
赵文霞
回凯宏
李鑫巍
刘欣
陈怀军
CHENG Yi;SONG Xuan;ZHU Hao;ZHAO Wenxia;HUI Kaihong;LI Xinwei;LIU Xin;CHEN Huaijun(College of Chemistry and Chemical Engineering,Ningxia Normal University,Guyuan 756099,China)
出处
《电镀与涂饰》
CAS
北大核心
2022年第21期1510-1514,共5页
Electroplating & Finishing
基金
宁夏高等学校一流学科建设(教育学学科)(NXYLXK2017B11)
宁夏自然科学基金(2020AAC03266,2022AAC03298)
宁夏科技创新领军人才项目(KJT2016004)
宁夏青年拔尖人才“国家级学术技术带头人后备人选”(宁人社函[2017]787号)
固原市科技计划项目(2020GYKYF003)
宁夏师范学院六盘山资源工程技术研究中心(HGZD22-18)
校级大学生创新项目(Z202214,X202210753193)
