摘要
研究了以次磷酸钠为还原剂的化学镀铜过程。确立了以硫酸铜为主盐,次磷酸钠为还原剂,乙二胺四乙酸二钠和柠檬酸钠为混合配位剂的碱性还原镀铜体系。在铸铁基体上实现了铜的连续自催化沉积,获得了较光亮、红黄色的铜镀层。
The process of the electroless copper plating using sodium hypophosphite as reductant was studied.An alkaline electroless copper plating bath with copper sulfate as main salt,sodium hypophosphite as reducing agent,EDTA and sodium citrate as blending chelating agent,was established.A continuous self-catalyzed deposition of bright red-yellow copper coating on cast iron substrate was obtained.
出处
《电镀与环保》
CAS
CSCD
北大核心
2009年第6期33-35,共3页
Electroplating & Pollution Control
关键词
化学镀铜
次磷酸钠
还原剂
铸铁
electroless copper plating
sodium hypophosphite
reductant
cast iron
