摘要
为满足在有限空间内设计数字模块的要求,达到模块散热性能优越且重量轻的目的,对一种数字模块的结构及散热进行综合设计,利用Icepak仿真软件分别对5种模块结构在20℃和45℃的散热进行分析,得到最大温升与理论计算基本吻合,并通过核算验证了敏感器件结温不超过许用结温,综合考虑结构重量轻要求,最终选择了一种最优模块结构。本文模块设计过程同时兼顾结构及散热,提高了结构设计效率,可供其他类似结构设计参考。
In order to meet the requirements of designing digital module in limited space and achieve the purpose of superior heat dissipation performance and light weight of the module,this paper designs the structure and heat dissipation of a digital module comprehensively,uses Icepak simulation software to analyze the heat dissipation of five module structures at 20℃and 45℃,and the maximum temperature rise is basically consistent with that of theoretical calculation.Through accounting,it is verified that the junction temperature of sensitive device is less than allowable junction temperature.Considering the requirements of light structure weight,an optimal module structure is finally selected.The module design process in this paper takes into account the structure and heat dissipation at the same time,which improves the efficiency of structural design and can be used as a reference for other similar structural designs.
作者
唐兵
TANG Bing(China Thunder Information Technology Co.,Ltd,Nanjing 210012,China)
出处
《舰船电子对抗》
2022年第2期113-117,共5页
Shipboard Electronic Countermeasure
