摘要
近年来,聚酰亚胺薄膜因其良好的柔韧性、透明度、耐辐射等优点,逐渐成为制备柔性电子器件的重要材料。利用飞秒激光双光子直写技术,以聚酰亚胺薄膜为基底,对负性光刻胶进行加工。研究发现线条分辨率随着激光功率的降低和扫描速度的增加而提高,并获得了115 nm最小线宽。柔韧性测试实验表明,在聚酰亚胺薄膜上制备的亚波长线条具有很好的柔韧性。这项工作证明了在聚酰亚胺薄膜上进行飞秒激光双光子直写的可行性,为进一步制造柔性电子器件提供了实验基础。
In recent years,polyimide(PI)film has become an essential material for flexible electronic devices due to its advantages such as good flexibility,transparency,and radiation resistance.In this paper,femtosecond laser two-photon direct writing technology was employed for damaging photoresist fabrication on the PI substrate.The line resolution increases with decreasing laser power and increasing scanning speed,and a 115 nm lateral resolution was obtained.The flexibility test shows the excellent flexibility of the sub-wavelength lines fabricated on PI film.This work proves two-photon direct writing feasibility on PI film and provides fundamental experiments for further flexible electronic devices manufacture.
作者
杨公瑾
毛彦超
吴亚南
张宝森
刘建
毛淼
陈述
YANG Gongjin;MAO Yanchao;WU Yanan;ZHANG Baosen;LIU Jian;MAO Miao;CHEN Shu(School of Physics,Zhengzhou University,Zhengzhou 450001,China)
出处
《激光杂志》
CAS
北大核心
2021年第4期21-24,共4页
Laser Journal
基金
国家自然科学基金(No.61505178)。
关键词
激光光学
飞秒激光
聚酰亚胺
双光子
光刻胶
laser optics
femtosecond laser
polyimide
two-photon
photoresist
