摘要
利用热机械分析法(TMA)测定微电子级聚酰亚胺薄膜的线膨胀系数[1],研究了不同负荷、不同升温速率等测试条件对线膨胀系数测定结果的影响,以及薄膜的不同厚度与线性热膨胀系数之间的关系.结果表明:测定聚酰亚胺薄膜线性热膨胀系数时,升温速率≤5℃/min且越接近5℃/min,承载负荷选择20 g时,测定结果准确性越高.相同用途的聚酰亚胺薄膜厚度越大,线性热膨胀系数值越大.
This paper adopts thermal mechanical analysis(TMA)to determine the linear thermal expansion coefficient ofmicroelectronic-grade polyimide films[1],to study the effects of different loads,different heating rates and other testconditions on the determination results of the linear thermal expansion coefficient,as well as the relationship between thefilm thickness and the linear thermal expansion coefficient.The results show that when the linear thermal expansioncoefficient of polyimide film is determined,if the heating rate is less than or equal to 5℃/min(especially it is close to 5℃/min),and the load is 20 g,the accuracy of the measurement results is the highest.It is also found that the greater thethickness of the polyimide film for the same use,the greater the linear thermal expansion coefficient value.
作者
赵芬娜
陈铸红
吴朋川
李永荃
王海清
ZHAO Fen-na;CHEN Zhu-hong;WU Pertg-chuan;LI Yong-quan;WANG Hai-qing(Anhui Guofeng Plastic Industry Co.Ltd.,Hefei 230088,China)
出处
《安徽化工》
CAS
2020年第4期69-70,73,共3页
Anhui Chemical Industry
