摘要
利用Gleeble-1500热模拟机对Al-Mg-Si-Cu合金进行高温压缩变形模拟实验,分析了变形温度、应变速率和应变量对显微组织的影响。结果表明:在应变速率和应变量一定时,变形温度较低时(380、430℃),合金变形带中未出现明显的再结晶晶粒,且有大量的位错杂乱的缠结在第二相粒子周围,形成位错塞积;变形温度较高时(480、530℃),变形带间出现了许多动态再结晶晶粒,晶粒的数量随着温度的升高而增加同时位错数量显著减少。在合金变形温度为480℃、应变量0.76时,再结晶晶粒随着应变速率升高,其数量有所增加而平均尺寸有所减小,再结晶程度增强。当合金在较低温度、较高应变速率和较小应变量下变形时,Al-Mg-Si-Cu合金主要软化机制为动态回复;在变形温度较高,应变速率较低,应变量较大时,合金的动态软化机制主要是动态再结晶。
The effects of deformation temperature, strain rate and strain on the microstructure of Al-Mg-Si-Cu alloy were analyzed by hot-compression test on Gleeble-1500 thermal simulator. The results show that when the strain rate and strain are constant, no obvious recrystallized grains appear in the deformation zone of the alloy when the deformation temperature is low(380 ℃ and 430 ℃), and a large number of dislocations tangle around the second phase particles, thus forming dislocation plugging;at higher deformation temperatures(480 ℃ and 530 ℃), there are many dynamic recrystallized grains between deformation zones. The number of grains increases with the increase of temperature, while the number of dislocations decreases significantly. When the deformation temperature is 480 ℃and the strain is 0.76, When the deformation temperature is low, the strain rate is high and the strain is small, the softening mechanism corresponding to the alloy is mostly dynamic recovery;when the deformation temperature is high, the strain rate is low and the strain is large, the softening mechanism corresponding to the alloy is mostly dynamic recrystallization.
作者
许忠仓
李赫亮
黄宏军
左晓姣
XU Zhongcang;LI Heliang;HUANG Hongjun;ZUO Xiaojiao(Zhongshan Sanfeng Metal Forging Co.,Ltd.Zhongshan 528400,China;School of Material Science and Engineering,Liaoning Technical University,Fuxin 123000,China;School of Material Science and Engineering,Shenyang University of Technology,Shenyang 110000,China)
出处
《热加工工艺》
北大核心
2020年第14期66-70,共5页
Hot Working Technology
