摘要
有机电致发光二极管(Organic Light-Emitting Diode,OLED)显示因其全固态、自发光、具有高发光效率等优点,市场占有率逐年提高。然而,可靠封装仍然是困扰OLED显示领域的关键技术问题之一。首先从常见的OLED封装方法展开讨论,分析了各种结构特点与缺陷,其次论述了具有广大发展前景的薄膜封装技术封装结构发展历程,以及封装结构的改进。最后对目前常见的无机薄膜制备工艺与有机薄膜制备工艺进行了归纳对比,并对薄膜封装的发展提出了展望。
Organic Light-Emitting Diode have an increasing market share year by year due to their all-solid-state,self-luminous,and high luminous efficiency.However,reliable packaging is still one of the key scientific and technological issues that plagues the field of OLED display.This article starts with a discussion of common OLED packaging methods,analyzes various structural features and defects,and then discusses the development history of thin film packaging technology packaging structures with broad prospects for development and the improvement of packaging structures.Finally,the current comparison of common inorganic thin film preparation processes and organic thin film preparation processes is summarized,and the development of thin film packaging is proposed.
作者
彭荣
PENG Rong(Guangzhou Vocational and Technical University of Science and Technology,Guangzhou 510000,China)
出处
《电子与封装》
2020年第5期1-6,共6页
Electronics & Packaging
关键词
OLED
薄膜封装
无机封装工艺
有机封装工艺
OLED
thin film packaging
inorganic packaging process
organic packaging process
