摘要
利用Solidworks建模软件对某一航空电子产品中的某一电源板进行了三维建模,并利用ANSYS有限元分析软件,对该模型进行了模态分析和随机振动响应分析,从而发现该电路板在结构设计中存在的不合理环节,为印制电路板的进一步优化和改进提供理论依据,从而有效提高电子产品的抗振性能。
The three-dimensional modeling of a power supply board in a avionics product is carried out by using Solidworks modeling software,and the modal analysis and random vibration response analysis of the model are carried out by using ANSYS finite element analysis software.The unreasonable links in the structural design of the circuit board are found,which provides a theoretical basis for the further optimization and improvement of the printed circuit board,so as to effectively improve the anti-vibration performance of electronic products.
作者
刘晓娟
Liu Xiaojuan(AVIC Taiyuan Aviation Instrument Co.,Ltd.,Taiyuan Shanxi 030006)
出处
《机械管理开发》
2020年第1期7-9,共3页
Mechanical Management and Development
