摘要
以额定电流为500 A的电弧触发器作为研究对象,针对在触发器熔体上电镀5μm厚的锡层,进行了数学建模和分析,利用COMSOL平台的电热耦合模块建立了电弧触发器的弧前仿真模型,仿真计算获得触发器在4 kA过载电流下的弧前时间为7.5 s;制作了镀锡厚度为5μm的电弧触发器试验样品,进行了弧前特性试验,试验结果与仿真结果基本一致。在此基础上研究了不同镀锡厚度下的弧前时间,仿真结果表明镀锡的厚度越薄,触发器的弧前时间越短。
The arc flip-flop with rated current of 500 A is taken as the research object.The mathematical modeling and analysis were carried out for the tin layer plated on the flip-flop melt with a thickness of 5μm.The simulation model of arc flip-flop was established by using the electrothermal coupling module of COMSOL platform.The simulation results show that the per-arc time of the flip-flop under 4 kA overload current is 7.5 seconds,and then the arc trigger test sample with tin plating thickness of 5μm was made.The pre-arc characteristic test was carried out.The test results are basically consistent with the simulation results.On this basis,the pre-arc time under different tin plating thickness was studied.The simulation results show that the thinner the tin plating thickness is,the shorter the pre-arc time of the trigger is.
作者
付雪
戚连锁
庄劲武
鄢玲
陆伟
FU Xue;QI Liansuo;ZHUANG Jinwu;YAN Ling;LU Wei(College of Electrical Engineering,Naval University of Engineering,Wuhan 430033,China)
出处
《电器与能效管理技术》
2020年第1期46-50,共5页
Electrical & Energy Management Technology
关键词
冶金效应
镀层厚度
弧前时间
电阻率
metallurigical effect
plating thickness
pre-arc time
resistivity
