期刊文献+

甲基磺酸体系镀锡液中Fe2+含量对镀锡层性能的影响 被引量:7

Effect of Fe2+content in methanesulfonic acid tin electroplating bath on properties of tin coating obtained therefrom
在线阅读 下载PDF
导出
摘要 通过扫描电子显微镜分析、贴滤纸法测试和塔菲尔曲线测量考察了甲基磺酸(MSA)体系镀锡液中Fe^2+质量浓度对镀锡层耐蚀性的影响。结果表明:当镀液中Fe^2+质量浓度大于5 g/L时,镀层中就会出现针孔,当镀液中Fe^2+质量浓度大于10 g/L时会严重影响镀层的耐蚀性。在实际生产中应将镀液的Fe^2+质量浓度控制在10 g/L以下。 The effect of mass concentration of Fe^2+ on corrosion resistance of tin coating electroplated from a methanesulfonic acid(MSA) bath was studied by scanning electron microscopy,ferroxyl test,and Tafel curve measurement.The results showed that pinholes appeared in coating when the mass concentration of Fe^2+ in bath was higher than 5 g/L,and the corrosion resistance of tin coating was seriously affected when the mass concentration of Fe^2+ was higher than 10 g/L.The mass concentration of Fe^2+ in the MSA tin electroplating bath should be controlled lower than 10 g/L.
作者 万一群 沈鹏杰 吉学军 胡建军 王传荟 WAN Yi-qun;SHEN Peng-jie;JI Xue-jun;HU Jian-jun;WANG Chuan-hui(Shougang Jingtang Iron and Steel United Co.,Ltd.,Tangshan 063299,China)
出处 《电镀与涂饰》 CAS CSCD 北大核心 2019年第23期1266-1268,共3页 Electroplating & Finishing
关键词 镀锡板 甲基磺酸 亚铁离子 耐蚀性 tinplate methanesulfonic acid ferrous iron corrosion resistance
  • 相关文献

参考文献4

二级参考文献24

  • 1沈慕昭,张立茗,郁楠.酸性镀锡液稳定性的研究[J].电镀与精饰,1990,12(5):7-10. 被引量:7
  • 2上海化工学院等编.无机化学实验[M].北京:人民教育出版社,1979..
  • 3方景礼.电镀配合物-理论与应用[M].北京:化学工业出版社,2007.
  • 4Swanson J L, Federman G A, Hahn D, et al. Iron removal from a methane sulfonic acid tin plating solution[A]. 9th Continuous steel strip plating symposium proceedings [ C ]. NACE, 1999 : 111 - 120.
  • 5WALSH F C, PONCE DE LEON C. Versatile electrochemical coatings and surface layers from aqueous methanesulfonic acid [J]. Surface and Coatings Technology, 2014, 259 (Part C): 676-697.
  • 6LOW C T J, WALSH F C. Normal and anomalous electrodeposition of tin-copper alloys from methanesulphonic acid bath containing perfluorinated cationic surfactant [J]. Transactions of the Institute of Metal Finishing, 2008, 86 (6): 315-325.
  • 7FUKUDA M, IMAYOSHI K, MATSUMOTO Y. Effect of adsorption of polyoxyethylene laurylether on electrodeposition of Pb-free Sn alloys [J]. Surface and Coatings Technology, 2003, 169/170:128-131.
  • 8BARRY F J, CUNNANE V J. Synergistic effects of organic additives on the discharge, nucleation and growth mechanisms of tin at polycrystalline copper electrodes [J]. Journal of Electroanalytical Chemistry, 2002, 537 (1): 151-163.
  • 9LOW C T J, WALSH F C. Electrodeposition of tin, copper and tin-copper alloys from a methanesulfonic acid electrolyte containing a perfluorinated cationic surfactant [J]. Surface and Coatings Technology, 2008, 202 (8): 1339-1349.
  • 10LEE J Y, KIM J W, CHANG B Y, et al. Effects of ethoxylated α-naphtholsulfonic acid on tin electroplating at iron electrodes [J]. Journal of the Electrochemical Society, 2004, 151 (5): C333-C341.

共引文献33

同被引文献37

引证文献7

二级引证文献10

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部