摘要
QFN封装成为CTP触控模组主流IC封装之一。阐述CTP-IC的FPC设计、焊盘开窗及钢网设计等上游优化方案。关注焊膏工艺参数的内在联系,SMT制程特控点及QFN焊点检测方法,从而提升CTP触控模组SMT生产直通率和焊点可靠性。
QFN packaging has become one of the mainstream IC packaging of CTP touch module. The upstream optimization schemes of CTP-IC such as FPC design, pad windowing and steel mesh design are described. This paper focuses on the internal relationship of solder paste process parameters, SMT process control points and QFN solder joint detection methods, so as to improve the CTP touch module SMT production through rate and solder joint reliability.
作者
黄贵松
邓雄
崔卫星
HUANG Guisong;DENG Xiong;CUI Weixing(Shantou Ultrasound Display Co.,Ltd,Guangdong 515065,China.)
出处
《集成电路应用》
2019年第8期60-61,共2页
Application of IC
基金
广东省科技企业科技创新课题项目
关键词
QFN封装
焊点检测
表面贴装
QFN package
solder joint detection
surface mounting
