摘要
随着我国航天产品的小型化、轻量化、高可靠要求的不断提高,以厚膜功率电源模块逐渐取代传统的基于印制板的电子产品,广泛应用。厚膜产品由于尺寸小、电路密集、焊盘间距小、装配密度高等特点,在装联过程中引入的微小污染物,会对厚膜电源模块水汽含量、电性能等造成恶劣影响,从而影响了长期可靠性。汽相清洗有别于传统的超声、机械清洗,具有无损伤、无残留、高效的特点。本文主要针对星载厚膜模块的汽相清洗工艺进行说明,并且对清洗效果进行评价和分析。
Herein,we experimentally addressed the cleaning of spacecraft power-supply module comprising thick film hybrid integrated circuits(HIC)and electrical components assembled in multi-chip module(MCM)technology with the lab-built vapor steam cleaner.The influence of the experimental conditions,such as the treating time/temperature,in the five procedures,including the soaking in liquid cleaning agent,vapor bathing,spraying,rinsing and drying,on the cleanliness and properties of the components was investigated for cleaning conditions opti丒mization.The test results show that the newly-developed vapor cleaning technique satisfies all the stringent requirements and outperforms the conventional cleaning methods,such as manual cleaning,ultrasonic cleaning and water cleanings,because of greater preservation of all mechanical and electrical properties,less damages/contaminations,better cleanliness,higher reliability and longer service life of power supply module in space environment.
作者
李杨
张宝林
李华
李松玲
孙晓峰
万成安
Zhang Baolin;Li Songling;Sun Xiaofeng;Wan Chengan(Tianjin University,Tianjin 300072,China;China Academy of Space Technology,Beijing Spacecrafts,Beijing 100094,China;Hebei University of Technology,Tianjin 300401,China)
出处
《真空科学与技术学报》
EI
CAS
CSCD
北大核心
2019年第4期310-315,共6页
Chinese Journal of Vacuum Science and Technology
关键词
汽相清洗
多余物
电子产品
可靠性
Vapor cleaning
Contaminants
Electronic products
Reliability
