摘要
用二甲苯胺取代溴化季铵盐作催化剂、用甲苯部分取代二氧六环作溶剂合成了阻焊剂用准水溶性丙烯酸改性光敏酚醛环氧树脂。其琥珀酸酐的转化率在相同的反应温度、相同的反应时间下不低于未取代体系的实验数据。实验发现 ,含有 31 %的二氧六环的混合溶剂有利于反应的进行 ;当n(环氧基 )∶n(丙烯酰 )∶n(羧基 ) =5∶5∶4 .9时 ,其树脂能溶于 1 %的碳酸钠溶液中 ;当交联体系中活性稀释剂的碳碳双键数与光敏树脂中碳碳双键数相近、光敏树脂∶马来酸酐 =2 .39∶1 (w/w)时 ,漆膜的性能最佳 ,可耐温 2 30℃并具有优良的耐酸、耐碱、耐溶剂性能及优良的力学性能。
A pseudo water soluble photosensitive epoxy phenolic resin for circuit board was synthesized by using N,N-dimethylaminobenzene as a catalyst to replace quaternary ammonium bromide and toluene as a solvent to partially replace dioxane. Experimental results show that about 31%(w) of dioxane in mixed solvents is suitable to the synthesis reaction.The resin obtained can dissolve in 1%?NaCO 3 solution when epoxy group∶ acrylic group ∶ carboxyl group= 5∶5∶4.9?(mol ratio). The properties,such as acid resistance, base resistance, solvent resistance and adhesion of the coating made from the resin are excellent and the heat resistance is outstanding up to 230?℃, When quantity of carbon carbon double bonds(mol) of photosensitive curable reagent TMPTA is about equal to that of photocurable resin and weight ratio of synthesized resin ∶ thermo crosslinking reagent is about 2.39∶1.
出处
《四川大学学报（工程科学版）》
EI
CAS
CSCD
2002年第5期52-55,共4页
Journal of Sichuan University (Engineering Science Edition)
基金
湖北省科技厅资助项目
关键词
合成
工艺
琥珀酸酐
阻焊剂
水溶性光敏树脂
耐高温光敏树脂
环氧树脂
succinic anhydride
printed circuit board
pseudo water soluble photosensitive resin
epoxy phenolic resin
heat resistant photosensitive resin
