摘要
3D封装方法允许大功率POL模块型稳压器占用很小的PCB面积,允许高效率散热。介绍了通过3D封装架构和灵活的组件放置方式解决热量问题的μModule稳压器LTM4636系列的性能特点。
3D packaging allows high-power POL module regulator to cover small PCB area and dissipate heat efficiently. This paper introduces the performance characteristics of μModule regulator, LTM4636, which is able to solve heat problem through 3D packaging structure and flexible component placement.
出处
《电源世界》
2018年第1期26-29,共4页
The World of Power Supply
