摘要
基于高温共烧陶瓷(HTCC)工艺,利用共面波导和同轴线理论,设计了一款应用于X波段的双面多腔陶瓷外壳,以实现四通道T/R组件封装外壳的小型化、轻量化、低成本以及微波性能要求。首先,用HFSS软件对射频传输结构进行优化,其次利用HTCC工艺平台制作外壳样品,最后利用夹具、矢量网络分析仪和GSG探针测试微波传输性能。该外壳的微波性能测试结果为:X波段内,输出通道插入损耗≤0.7dB,回波损耗≥21.7dB;输入通道插入损耗≤1.18dB,回波损耗≥14.6dB。在考虑了测试基板和所键合金丝影响之后,测试结果与设计值吻合度较好。
According to the coplanar waveguide and coaxial line theory,a double sided multicavity ceramic package was designed based on HTCC technology for X-band four-channel T/R module application to achieve performance requirements of miniaturization,light-weight,lowcost,and microwave transmission.Low insert loss and return loss were realized by optimizing the transmission structure model with HFSS software.The package samples were fabricated on HTCC technology platform and measured by fixture,vector network analyzer and GSG probe.It was shown that for RF output feedthrough the insert loss was less than 0.7 dB and return loss was more than 21.7 dB,and for RF input feedthrough the insert loss was less than 1.18 dB and return loss was more than 14.6 dB.
出处
《固体电子学研究与进展》
CAS
CSCD
北大核心
2018年第1期66-69,共4页
Research & Progress of SSE
关键词
双面多腔陶瓷外壳
T/R组件
小型化
低成本
微波传输
double sided multi-cavity ceramic package
T/R module
miniaturization
low cost
microwave transmission
