摘要
基于热电分离式设计理念,将AlN陶瓷片金属化后作为微散热器嵌入FR4材料内形成了复合散热基板。采用电镜扫描、光学显微,通过冷热循环冲击试验对FR4与AlN两相界面处在高低温突变情况下的界面形貌进行了分析。利用ANSYS软件对基板进行了仿真热模拟,研究了AlN嵌入后FR4导热性能的变化规律。利用结温测试仪、功率计和半导体制冷温控台等仪器设备,通过结温测试对比研究了该复合散热结构与金属芯印刷电路板(MCPCB)对大功率LED封装散热效果的影响。结果表明,该复合散热基板在经低温-55℃,高温125℃,1 000个冷热循环后,FR4和AlN界面无剥离现象发生,在环境温度急剧变化的条件下结合力良好。同时,FR4在嵌入AlN之后,导热性能得到了明显改善,且与MCPCB相比,能更有效降低LED芯片结温。
Based on the design concept of thermoelectric separation,the metalized AlN ceramic as micro heat radiator was embedded into the FR4 material to form a composite thermal substrate. The interface morphology between FR4 and AlN under high and low temperature change was ana lyzed through thermal shock test with scanning electron microscope and optical microscope. A thermal simulation of the substrate was carried out by using ANSYS software,and the change rule of the thermal conductivity of FR4 after being embedded with AlN was studied. With junction temperature tester,power meter,semiconductor refrigeration temperature control platform and other equipment,the influences of the composite structure and the metal core printed circuit board（ MCPCB） on the heat dissipation effect of the high power LED package were comparatively studied through the junction temperature test. The results show that the composite substrate has no delamination at the interface between FR4 and AlN after 1 000 thermal cycles at-55 ~ 125 ℃. The bonding force is good under the condition of drastic change of ambient temperature. Meanwhile,the thermal conductivity of the FR4 is greatly improved after being embedded with AlN,and it can more effectively reduce the junction temperature of the LED chip compared with MCPCB.
出处
《半导体技术》
CSCD
北大核心
2017年第11期864-869,共6页
Semiconductor Technology
关键词
热电分离
氮化铝
FR4材料
导热
LED封装
thermoelectric separation
A1N
FR4 material
thermal conduction
LED packaging
