摘要
在印制电路板中局部混压高频材料不仅可以降低信号在高频下的损耗,满足通信领域的技术发展需求,同时还可以降低PCB制作成本。本文首先从设计、工艺要求以及制作流程三方面介绍了局部混压技术,总结并分析了局部混压PCB在制作过程中容易遇到的板翘、错位以及混压界面缝隙填胶空洞、凹陷等问题,然后针对问题从混压材料的匹配、层压参数和局部混压子母板定位技术三方面着手提出了改善方案并进行了实验验证。实验表明,局部混压PCB板的翘曲度和子母板对位能力都得到了较大改善,可以满足层数为12层的PCB板在埋入子板后,内层Clearance能力小于0.175mm;混压界面缝隙填胶无空洞及凹陷,热应力测试(288℃/10 s/5次)和无铅回流焊测试(5次)无分层问题。
Partial hybrid high frequency materials in PCB board can not only reduce the signal loss at high frequencies to satisfy the technological demands of the development of communications,but also can reduce the cost of PCB production.The paper firstly introduced the partial hybrid technology in the view of design,technical requirements and production processes and then problems such as board bend,dislocation and holes in interface gap that often appeared in the fabrication of PCB were summarized and analyzed.After that,improving methods from three aspects of materials match,lamination parameters and the positioning technology between mother-board and sub-board were proposed and following the experimental validation.The results indicated that the board bend degree and the positioning technology between mother-board and sub-board of partial hybrid PCB had been greatly improved to meet the inner Clearance capacity of less than 0.175 mm after burring sub-board in 12 layers PCB and the glue in the partial hybrid interface gap had no filling holes and delamination after thermal stress test（288℃/10 s /5 times） and lead-free reflow test（5 times）.
出处
《印制电路信息》
2011年第4期37-43,共7页
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