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工艺参数对直流磁控溅射法制备氧化铝薄膜的试验研究 被引量:4

Research of process parameters on alumina thin flims deposited by DC magnetron sputtering
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摘要 采用直流磁控溅射法在载玻片和不锈钢基底上制备某设计要求的氧化铝薄膜,首先采用单因素法分别分析溅射功率、氧气流量、工作压强、负偏压及本底真空度等制备参数对薄膜沉积速率的影响;在此基础上设计正交试验,研究优化范围内溅射功率、氧气流量、工作压强对沉积速率的影响,并进行极差与方差分析。结果表明,在一定工艺参数范围内,随着溅射功率的增加,薄膜的沉积速率不断增大;氧气流量增加时薄膜的沉积速率不断下降;随着工作压强的增大,薄膜的沉积速率先增大后减小,在1.0 Pa时达到最大速率;加载的负偏压增加时,薄膜的沉积速率不断降低;本底真空度提高时薄膜的沉积速率不断增大;通过使用XRD衍射仪对制备的薄膜进行物相检测,研究结果表明,常温下不同氧气流量制备的氧化铝薄膜均为非晶态;获取了制备所需薄膜的较优的制备工艺。 A design requirements of alumina films were prepared on slides and stainless steel substrate by DC reactive magnetron sputtering method. Firstly,the method of single factor respectively analysis of sputtering power,oxygen flow rate,pressure,negative bias voltage and at the bottom of the vacuum degree preparation the effects of parameters on the deposition rate; based on orthogonal design,optimization study within the scope of the sputtering power,oxygen flow,working pressure on the deposition rate effect and range analysis and variance analysis. Results show that with the increase of the sputtering power and the thin film deposition rate increases within a certain range of parameters; with the increase of oxygen flow rate and the deposition rate of the films decreases; with the intensity increasing work pressure and the deposition rate of the films increases first and then decreases and at 1.0 Pa reached maximum rate; with increasing negative bias and the deposition rate decreases; with increase of the vacuum degree and the deposition rate increasing. By using X-ray diffraction( XRD) of thin films prepared by the phase detection. The results of the study show that at room temperature under different oxygen flow preparation of alumina films were amorphous; get the preparation of desired film better preparation process.
出处 《制造技术与机床》 北大核心 2017年第3期126-130,135,共6页 Manufacturing Technology & Machine Tool
基金 山西省国际科技合作项目(2015081018)
关键词 直流磁控溅射 氧化铝薄膜 沉积速率 正交试验 非晶态 DC magnetron sputtering alumina film deposition rate orthogonal test amorphous
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