摘要
简述了酸性硫酸盐镀铜添加剂的基本组成和研究状况,分析了添加剂之间的相互作用。通过对酸性硫酸盐镀铜添加剂研究进展的介绍,认为开发具有性能优越和价格低廉特点的复配添加剂是目前研究的主要方向,同时,完善电镀工艺技术也是新形势下酸性硫酸盐电镀铜发展的主要趋势。
The research status and composition of additives for acidic sulfate copper plating were introduced, and inter-reactions among the additives were also analyzed in this paper. It could be thought that exploring the composite additives with perfect performance and low price is the main direction in recent research, and improving the plating technology is also the main trend in the development of acidic sulfate copper plating.
作者
李立清
王义
安文娟
LI Liqing WANG Yi AN Wenjuan(School of Metallurgical and Chemical Engineering, Jiangxi University of Science and Technology, Ganzhou 34100, China)
出处
《电镀与精饰》
CAS
北大核心
2016年第11期20-23,共4页
Plating & Finishing
基金
国家自然科学基金项目(21406097)
江西省博士后择优项目(2015KY11和2015RC17)
江西省教育厅基金项目(GJJ150668)
