摘要
粘模导致的塑封产品表面裂纹是半导体塑封工艺中的一种常见失效,实际生产中通常使用固定的润模周期来进行预防。目前SOT产品连续成模300次左右即会发生粘模,作者通过对其失效机理的深入研究,并对导致粘模的失效原因进行了相关假设与验证,最终通过优化塑封料中脱模剂配方成功解决了SOT产品的粘模难题。
Package crack caused by sticking is a common failure in mold process, periodic die conditioning is always being used in mass production as an preventive action. Currently, SOT product can only sustain about 300 shots before sticking, via in-depth exploration on the failure mechanism the author has worked out hypothesis testing on those potential root causes, finally the problem was successfully solved by formula optimization on releasing agent of mold compound.
出处
《中国集成电路》
2016年第10期72-78,共7页
China lntegrated Circuit
关键词
粘模
塑封
润模
SOT
脱模剂
Sticking
Mold
Conditioning
SOT
Releasing agent
