摘要
针对铌酸锂晶片在磨削加工时经常发生断裂的问题,对晶片断裂的原因进行了理论分析,并从晶体学的角度分析发现断裂与实验采用的晶片晶体结构有关。提出了基于多物理场耦合软件COMSOL Multiphysics对铌酸锂晶片磨削加工仿真的方法,为模拟铌酸锂晶片磨削减薄过程,对比分析了7种不同厚度的铌酸锂晶片在磨削加工时的应力分布和变形情况,对有外加电载荷磨削加工情况也进行了耦合仿真。研究结果表明,未施加电场时铌酸锂晶片的变形量随着晶片减薄过程逐渐减小,当铌酸锂晶片减薄至80μm时,晶片的外围出现均匀分布的4个应力集中位置,容易导致晶片产生裂纹甚至破裂;铌酸锂晶片变形量因外加电载荷而减小,因此合理施加外电场能够有效减弱晶片的应力集中趋势。
Aiming at solving the problems of lithium niobate chip while grinding,the reason for fracture of lithium niobate chip in experiment was briefly proposed with crystallographic options. Finite element analysis method using COMSOL Multiphysics was empolyed for simulating grinding lithium niobate crystals. To simulate the process of grinding and thinning lithium niobate chip,its deformation and stress when grinding were analyzed under seven kinds of thickness for lithium niobate chip. Also grinding lithium niobate chip under electric load was simulated. The results indicate that deformation displacement of lithium niobate chip is gradually decreased while grinding under no electric load and the stress of four symmetric area on lithium niobate chip is much bigger when its thickness was 80 μm,which are inclined to fracture. And the results also show that deformation and stress concentration of lithium niobate chip is degraded which under electric load.
出处
《机电工程》
CAS
2016年第9期1071-1075,共5页
Journal of Mechanical & Electrical Engineering
基金
浙江省自然科学基金资助项目(Y14E050057)
