摘要
通过正交试验和单因素试验对无氰电镀银的镀液组成和工艺条件进行优化,得到最佳镀液组成和工艺条件为：硝酸银45 g/L,丁二酰亚胺80 g/L,焦磷酸钾70 g/L,5,5-二甲基乙酰脲（DMH）15 g/L,氢氧化钾40 g/L,p H 9.0-9.5,温度20-30°C,电流密度0.35-0.45 A/dm2,时间30 min。在此条件下,镀液的阴极电流效率高达99.2%,覆盖能力、分散能力和稳定性良好。所得镀层光亮,结合力良好,纯度高（银含量为100%）,抗变色能力优于氰化镀银层。
The process conditions for cyanide-free silver electroplating were optimized by orthogonal test and single-factor experiment. The optimized bath composition and process conditions are as follows： silver nitrate 45 g/L, succinimide 80 g/L, 5,5-dimethylhydrazine （DMH） 15 g/L, potassium hydroxide 40 g/L, temperature 20-30 ℃, pH 9.0-9.5, current density 0.35-0.45 A/dm2 and time 30 rain. Under the given conditions, the bath features a current efficiency up to 99.2%, good covering and throwing power, and high stability. The obtained silver coating has bright surface, strong adhesion, high purity with a silver content of 100% and better anti-tarnishing property as compared with the silver coating prepared from a cyanide bath.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2016年第3期126-130,共5页
Electroplating & Finishing
基金
2015贵州省科技计划(黔科合GZ字[2015]3032)
关键词
无氰电镀银
丁二酰亚胺
焦磷酸钾
5
5-二甲基乙酰脲
cyanide-free silver electroplating
succinimide
potassium pyrophosphate
5,5-dimethylhydrazine
