摘要
介绍了电路组装技术对基片的性能要求、性能影响因素及基片设计原则 ,评述了高频基片复合材料的发展现状 ,并提出未来研究工作的重点。
Substrate properties required by circuit mount technology, various factors to effect the properties, and principles to design the high frequency substrate are introduced,and development of the high frequency substrate composite as well as some suggestions on future research are presented.
出处
《宇航材料工艺》
CAS
CSCD
北大核心
2002年第3期16-21,共6页
Aerospace Materials & Technology
